10CX105YF780I5G vs 10CX105YF780E6G Comparaison
Comparaison détaillée côte à côte de 10CX105YF780I5G par Intel et 10CX105YF780E6G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
10CX105YF780E6G - Cyclone 10 GX FPGA, 104K LE, 780-FCBGA | Altera/Intel
10CX105YF780E6G ✓ ActifComparaison des spécifications
| Paramètre | 10CX105YF780I5G | 10CX105YF780E6G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $115,00 | $580,00 |
| Series | Cyclone 10 GX | — |
| Logic Elements | 105,000 LE | — |
| Adaptive Logic Modules (ALMs) | 38,000 ALM | — |
| Embedded Memory | 8,641,536 bits (8.4 Mbit) | — |
| Number of I/O | 284 | — |
| Number of Transceivers | [DATA_NEEDED: exact transceiver count for 10CX105 F780] | — |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Operating Supply Voltage (Core) | 0.9 V | — |
| Plage de température de fonctionnement | -40C to +100C (Industrial) | — |
| Style de montage | SMD/SMT | — |
| Package Type | 780-BBGA, FCBGA (F780) | — |
| Package Code | BGA, SQUARE | — |
| Terminal Form | BALL | — |
| Number of Terminals | 780 | — |
| Process Technology | 20 nm | — |
| Hard PCIe IP | PCIe Gen2 x4 (per Cyclone 10 GX family) | — |
| Design Software | Intel Quartus Prime Lite/Pro | — |
| Statut RoHS | Compliant | Compliant |
| Temperature Grade | Industrial (I) | — |
| Speed Grade | 5 | — |
| Family | — | Cyclone 10 GX |
| Series / Model | — | 10CX105 |
| Logic Elements (LE) | — | 104,000 |
| Embedded Memory Bits | — | 8,641,536 (8.5 Mb) |
| DSP Blocks / 18x19 Multipliers | — | 156 |
| User I/O Count | — | 284 |
| Transceivers | — | 6 channels, up to 12.5 Gbps |
| PCIe Hard IP | — | 1 x PCIe Gen2 (x1/x2/x4) |
| LVDS SERDES | — | Up to 1.4 Gbps |
| External Memory Interface | — | DDR3/DDR3L/LPDDR2 up to 3.0 Gbps |
| Process Node | — | 20 nm TSMC |
| Core Voltage | — | 1.0 V |
| Auxiliary Voltage | — | 0.9 V |
| Boîtier | — | 780-ball FCBGA (F780) |
| Température de fonctionnement | — | -40C to +100C (industrial) |
| Configuration Mode | — | FPP and AS |