10M02DCU324I7G vs 10M02DCV36C7G Comparación
Comparación detallada lado a lado de 10M02DCU324I7G por Intel y 10M02DCV36C7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M02DCU324I7G | 10M02DCV36C7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,55 | $2,34 |
| Family | MAX 10 | — |
| Logic Elements (LEs) | 2,000 | — |
| Embedded Memory (M9K blocks) | 16 | — |
| Embedded Memory (bits) | 110,592 | — |
| Embedded Multipliers (18x18) | 16 | — |
| User I/O Count | 160 | — |
| User I/O Banks | 8 | — |
| Encapsulado | 324-ball UBGA (U324) | 36-WFBGA, WLCSP |
| Pin/Pitch | 324 balls / 0.8 mm pitch | — |
| Process Node | 55 nm | — |
| Configuration Memory | On-chip dual-boot flash | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Block | 12-bit SAR ADC with temperature sensor | — |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Non-volatile field-programmable gate array |
| Series | — | MAX 10 |
| Logic Elements | — | 2,000 |
| I/O Pins | — | 27 |
| Embedded Memory | — | 110,592 bits |
| Operating Voltage | — | 1.2 V |
| Process Technology | — | 55 nm |
| Tipo de montaje | — | Surface Mount |
| FPGA Configuration | — | Non-volatile |
| Logic Architecture | — | Field-programmable gate array |
| Product Category | — | Embedded FPGA |
| Package Pin Count | — | 36 balls |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |