10M04DAF256C7G vs 10M25DAF256C8G Comparación
Comparación detallada lado a lado de 10M04DAF256C7G por Intel y 10M25DAF256C8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M04DAF256C7G | 10M25DAF256C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,45 | $45,30 |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | 25,000 |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | — |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Encapsulado | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | — |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Lead-Free | Yes | — |
| Embedded Memory | — | 1,728 Kbits |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| PLLs | — | 4 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Speed Grade | — | C8 |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |