10M04DAF256C7G vs 10M25DAF256C8G Comparaison
Comparaison détaillée côte à côte de 10M04DAF256C7G par Intel et 10M25DAF256C8G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10M04DAF256C7G | 10M25DAF256C8G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $9,45 | $45,30 |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements (LE) | 4,000 | 25,000 |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | — |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Boîtier | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | — |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Lead-Free | Yes | — |
| Embedded Memory | — | 1,728 Kbits |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| PLLs | — | 4 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Speed Grade | — | C8 |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |