10M04DAU324C8G vs 10M02DCU324A7G Comparación
Comparación detallada lado a lado de 10M04DAU324C8G por Intel y 10M02DCU324A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M04DAU324C8G | 10M02DCU324A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $6,30 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 4,000 | — |
| Embedded Memory | 193,536 bits | 110,592 bits |
| User I/O | 246 | — |
| Encapsulado | 324-LFBGA | — |
| Package Code | U324 | — |
| Technology | 55 nm | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Ordering Part Number | 10M04DAU324C8G | — |
| Speed Grade | C8G | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| I/O Standard Support | [DATA_NEEDED: I/O standard support] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Timing Performance | [DATA_NEEDED: timing performance] | — |
| Embedded Multiplier Count | [DATA_NEEDED: embedded multiplier count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Maximum User I/O | 246 | — |
| Ball Grid Package | 324 balls | — |
| Device Manufacturer | Intel / Altera | — |
| Logic Elements (LE) | — | 2,000 |
| User I/O Count | — | 160 |
| Embedded 18x18 Multipliers | — | 16 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| User Flash Memory | — | Integrated (on-chip flash configuration) |
| Integrated ADC | — | 12-bit, 1 Msps+, successive approximation |
| Supply Voltage (VCCIO) | — | [DATA_NEEDED: VCCIO range] |
| Temperatura de unión de funcionamiento | — | -40 C to +125 C (TJ) |
| Package Type | — | 324-UBGA (Ultra FineLine BGA) |
| Package Dimensions | — | 15 x 15 mm |
| Process Technology | — | 55 nm embedded flash (TSMC) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free status] |