10M04DAU324C8G vs 10M02DCU324A7G Comparaison
Comparaison détaillée côte à côte de 10M04DAU324C8G par Intel et 10M02DCU324A7G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10M04DAU324C8G | 10M02DCU324A7G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $6,30 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 4,000 | — |
| Embedded Memory | 193,536 bits | 110,592 bits |
| User I/O | 246 | — |
| Boîtier | 324-LFBGA | — |
| Package Code | U324 | — |
| Technology | 55 nm | — |
| Core Voltage | 1.2 V | 1.15 V to 1.25 V |
| Ordering Part Number | 10M04DAU324C8G | — |
| Speed Grade | C8G | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| I/O Standard Support | [DATA_NEEDED: I/O standard support] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Timing Performance | [DATA_NEEDED: timing performance] | — |
| Embedded Multiplier Count | [DATA_NEEDED: embedded multiplier count] | — |
| Transceiver Count | [DATA_NEEDED: transceiver count] | — |
| Maximum User I/O | 246 | — |
| Ball Grid Package | 324 balls | — |
| Device Manufacturer | Intel / Altera | — |
| Logic Elements (LE) | — | 2,000 |
| User I/O Count | — | 160 |
| Embedded 18x18 Multipliers | — | 16 |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| User Flash Memory | — | Integrated (on-chip flash configuration) |
| Integrated ADC | — | 12-bit, 1 Msps+, successive approximation |
| Supply Voltage (VCCIO) | — | [DATA_NEEDED: VCCIO range] |
| Température de jonction en fonctionnement | — | -40 C to +125 C (TJ) |
| Package Type | — | 324-UBGA (Ultra FineLine BGA) |
| Package Dimensions | — | 15 x 15 mm |
| Process Technology | — | 55 nm embedded flash (TSMC) |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free status] |