10M16DAU324C8G vs 10M16SAU324I7G Comparación
Comparación detallada lado a lado de 10M16DAU324C8G por Intel y 10M16SAU324I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M16DAU324C8G | 10M16SAU324I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $35,40 | $32,40 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 16,000 | — |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | 246 |
| Encapsulado | 324-UBGA (Ultra FineLine BGA) | 324-pin UFBGA (U324) |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | — |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Temperatura de funcionamiento | Commercial (0C to +85C) - speed grade 8 | -40C to +100C (Industrial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Series | — | MAX 10 |
| Logic Elements | — | 16000 |
| Embedded Memory | — | 378 Kbits (M9K) |
| User Flash Memory | — | 562176 bits |
| Embedded Multipliers (18x18) | — | 45 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | 7 |
| On-die ADC | — | 12-bit SAR, up to 17 channels, 1 MSPS |
| Configuration | — | Internal flash, dual-boot, JTAG |