10M16DAU324C8G vs 10M16SAU324I7G Vergleich
Detaillierter Direktvergleich von 10M16DAU324C8G von Intel und 10M16SAU324I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M16DAU324C8G | 10M16SAU324I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $35,40 | $32,40 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 16,000 | — |
| Embedded Memory Bits | 562,176 | — |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in Kb] | — |
| Maximum User I/O | 246 | 246 |
| Gehäuse | 324-UBGA (Ultra FineLine BGA) | 324-pin UFBGA (U324) |
| Core Supply Voltage | 1.2 V (on-chip regulator) | — |
| Process Technology | TSMC 55 nm CMOS (non-volatile) | — |
| Configuration Memory | Internal flash, dual-boot capable | — |
| Embedded ADC | 12-bit SAR ADC | — |
| Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 4 |
| LVDS Performance | Up to 1.6 Gbps per pair | — |
| Memory Interface Support | DDR3, DDR2, LPDDR2 (hardened PHY) | — |
| Betriebstemperatur | Commercial (0C to +85C) - speed grade 8 | -40C to +100C (Industrial) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED] | — |
| Series | — | MAX 10 |
| Logic Elements | — | 16000 |
| Embedded Memory | — | 378 Kbits (M9K) |
| User Flash Memory | — | 562176 bits |
| Embedded Multipliers (18x18) | — | 45 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | 7 |
| On-die ADC | — | 12-bit SAR, up to 17 channels, 1 MSPS |
| Configuration | — | Internal flash, dual-boot, JTAG |