10M16SCE144A7G vs 10M50SCE144A7G Comparación
Comparación detallada lado a lado de 10M16SCE144A7G por Altera y 10M50SCE144A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M16SCE144A7G | 10M50SCE144A7G |
|---|---|---|
| Marca | Altera | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,50 | $12,85 |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 16,000 | 50,000 |
| Embedded Memory (Kb) | 562 Kb | — |
| Maximum User I/O | 101 | — |
| Logic Array Blocks (LABs) | 1000 | — |
| Embedded 18x18 Multipliers | 45 | — |
| Supply Variant | Single-supply (S) | — |
| Speed Grade | -A7 | — |
| Temperature Grade | Automotive (-A7: -40C to +125C) | — |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Maximum Operating Frequency | 450 MHz | — |
| Tensión de alimentación de funcionamiento | 3.0 V / 3.3 V | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| Configuration Memory | On-die non-volatile flash | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | Moisture Sensitive (per distributor data) | 3 (per JEDEC J-STD-020) |
| Factory Pack Quantity | 60 | — |
| Tradename | MAX | — |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count and total bits] |
| Total User Flash Bits | — | 1,677,312 bits |
| User I/O Count | — | 101 |
| Number of LABs/CLBs | — | 3,125 |
| Supply Voltage - Core | — | 1.2 V (internal) |
| Supply Voltage - I/O | — | 3.0 V / 3.3 V LVCMOS/LVTTL |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Encapsulado / Carcasa | — | 144-LQFP Exposed Pad (EQFP-144) |
| Number of PLLs | — | 2 |
| Integrated ADC | — | 12-bit, 1 MSPS (analog inputs package-dependent) |
| Configuration Method | — | On-chip non-volatile flash (instant-on, no external boot PROM) |
| Process Technology | — | TSMC 55 nm NOR-flash + SRAM |