10M25DAF256C8G vs 10M04DAF256C7G Comparación
Comparación detallada lado a lado de 10M25DAF256C8G por Intel y 10M04DAF256C7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF256C8G | 10M04DAF256C7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $45,30 | $9,45 |
| Family | MAX 10 | MAX 10 FPGA |
| Logic Elements (LE) | 25,000 | 4,000 |
| Embedded Memory | 1,728 Kbits | — |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Encapsulado | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm |
| Speed Grade | C8 | — |
| Temperature Grade | Commercial (0 °C to 85 °C) | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Maximum User I/Os | — | 178 |
| Embedded Memory (M9K blocks total) | — | 176 Kbits |
| User Flash Memory | — | 193,536 bits |
| Configuration Flash (on-die) | — | 1,178 Kbits (CFM0 + CFM1 dual-config) |
| Temperature Grade (junction) | — | 0C to 100C (commercial) |
| Auxiliary Voltage | — | 2.5 V / 3.3 V |
| ADC | — | 1 x 12-bit, 1 Msps SAR |
| PLL | — | 1 (general-purpose) |
| Process Technology | — | 55 nm TSMC flash-based |
| LVDS Transmitter (max data rate) | — | 800 Mbps |
| Lead-Free | — | Yes |