10M25DAF256C8G vs 10M50DAF256C8G Comparación
Comparación detallada lado a lado de 10M25DAF256C8G por Intel y 10M50DAF256C8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF256C8G | 10M50DAF256C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $45,30 | $47,85 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory | 1,728 Kbits | — |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | 4 |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Encapsulado | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-ball FBGA (F256) |
| Speed Grade | C8 | C8 (8 ns) |
| Temperature Grade | Commercial (0 °C to 85 °C) | Commercial (0C to +85C) |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-20) |
| Logic Elements | — | 49,760 (50K) |
| Embedded Memory (bits) | — | 1,677,312 |
| User Flash (bits) | — | 1,677,312 |
| Maximum User I/Os | — | 178 |
| Multipliers (18x18) | — | 312 |
| Global Clock Networks | — | 20 |
| On-chip ADC | — | 12-bit, 1 MSPS, single or dual supply |
| Process Technology | — | 55 nm |
| Configuration | — | Internal flash (non-volatile, instant-on) |