10M25DAF484A7G vs 10M25DAF484A7P Comparación
Comparación detallada lado a lado de 10M25DAF484A7G por Intel y 10M25DAF484A7P por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF484A7G | 10M25DAF484A7P |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,75 | $54,75 |
| Family | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Encapsulado | 484-ball BGA | 484-ball Plastic BGA (S-PBGA-B484) |
| Temperatura de funcionamiento | -40C to +125C (automotive) | — |
| Configuration Memory | On-chip flash (non-volatile) | — |
| PLLs | 8 | 2 (general-purpose) |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | 1 x 12-bit, 1 MSPS |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Process Technology | — | 55 nm non-volatile |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Temperature Grade | — | Automotive (-40 C to +125 C TJ) |
| Speed Grade | — | A7 |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| Tensión de alimentación | — | 3.3 V or 1.8 V single supply |