10M25DCF256I7G vs 10M25DCF256A7G Comparación
Comparación detallada lado a lado de 10M25DCF256I7G por Intel y 10M25DCF256A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DCF256I7G | 10M25DCF256A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,60 | $42,84 |
| Series | MAX 10 | — |
| Logic Elements (LE) | 25,000 | 25,000 |
| Number of LABs/CLBs | 1,563 | — |
| Total RAM Bits | 691,200 (675 Kbit) | — |
| Number of I/O Pins | 178 | — |
| Encapsulado / Carcasa | 256-LBGA (F256, 17x17 mm, 1.0 mm pitch) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C |
| Speed Grade | I7 (fastest industrial speed grade) | -7 |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| User Flash Memory | [DATA_NEEDED: user flash size in Mbit] | — |
| Embedded ADC | 12-bit, multi-channel (per MAX 10 family) | — |
| PLLs | [DATA_NEEDED: PLL count per F256 variant] | 4 |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Programming Method | JTAG / Passive Serial (via Quartus Prime) | — |
| Nivel MSL | 3 (per BGA handling) | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes | — |
| Packaging | Tray | — |
| Family | — | MAX 10 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (Kbits) | — | 1,728 |
| Embedded Memory (M9K Blocks) | — | [DATA_NEEDED: M9K block count] |
| Maximum User I/Os | — | 178 |
| DSP Blocks (18x18 Multipliers) | — | 45 |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Process Technology | — | TSMC 55nm NOR Flash |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 3.3 V (supports 1.2/1.5/1.8/2.5/3.3 V) |
| Configuration | — | Internal dual-configuration flash (non-volatile) |
| Integrated ADC | — | 12-bit, up to 1 Msps, 17 channels |
| Encapsulado | — | 256-ball FBGA (F256) |
| Temperature Grade | — | Commercial (0C to +85C) |
| Maximum Core Frequency | — | 450 MHz |