10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel
N.º de pieza: 10M25DCF256I7G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $32.1 | $3.210,00 |
| 500 | $29.4 | $14.700,00 |
| 1.000 | $27.6 | $27.600,00 |
10M25DCF256I7G Descripción general
A MAX 10 FPGA is a non-volatile, low-power programmable logic device that belongs to the broader category of FPGAs (Field Programmable Gate Arrays) within the integrated circuit hierarchy: FPGA > programmable logic > digital IC > semiconductor. Unlike SRAM-based FPGAs that require an external boot PROM, MAX 10 devices store their configuration in on-chip flash, enabling instant-on behavior and a single-chip bill of materials. This makes MAX 10 useful as a glue-logic, control, and bridge companion to higher-end processors and ASICs.
Key features of the 10M25DCF256I7G include 25K logic elements backed by 1,563 LABs, 691 Kbits of embedded RAM, 4 Mb of user flash memory, integrated 12-bit ADC with up to 17 channels, and 178 general-purpose I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and other single-ended and differential I/O standards. Embedded DSP blocks and PLLs provide flexible clock management and signal processing for motor control, sensor fusion, and industrial automation designs.
The MAX 10 architecture uses a Look-Up Table (LUT)-based logic fabric with routing switch matrices, on-die flash for configuration and user data, and hard IP blocks such as the ADC and PLLs. The flash-backed configuration gives deterministic power-on behavior (sub-100 ms wake-up) and supports remote field upgrades through standard JTAG or passive serial interfaces, eliminating the need for a separate boot memory.
Typical applications include industrial motor and motion control, factory automation I/O expansion, video bridging and display controllers, automotive body electronics and infotainment subsystems, and IoT edge nodes requiring deterministic boot. The integrated ADC also makes the device a strong fit for sensor aggregation and power-conversion control loops.
When designing with this part, plan I/O bank assignments early: the F256 package exposes four or more I/O banks, each with its own VCCIO supply; mixing 3.3 V LVCMOS with 1.8 V LVCMOS in the same bank requires level-shifting or careful bank voltage planning. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para 10M25DCF256I7G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M25DCF256I7G (mismo factor de forma y huella) — difiere en Package, Process Technology, Speed Grade, Logic Elements (LE), Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M25DCF256C8G
✅ Sustitución directa✓ En stock
$24.95 / unidad
Ver hoja de datos →10M25DCF256C7G
✅ Sustitución directa✓ En stock
$18.75 / unidad
Ver hoja de datos →10M25DCF256A7G
✅ Sustitución directa✓ En stock
$42.84 / unidad
Ver hoja de datos →10M16DCF256I7G
✅ Sustitución directa✓ En stock
$24.95 / unidad
Ver hoja de datos →10M08DCF256I7G
✅ Sustitución directa✓ En stock
$12.2 / unidad
Ver hoja de datos →10M25DCF256I7G Valores máximos y características eléctricas
| Series | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Number of LABs/CLBs | 1,563 |
| Total RAM Bits | 691,200 (675 Kbit) |
| Number of I/O Pins | 178 |
| Encapsulado / Carcasa | 256-LBGA (F256, 17x17 mm, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Speed Grade | I7 (fastest industrial speed grade) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Embedded ADC | 12-bit, multi-channel (per MAX 10 family) |
| Programming Method | JTAG / Passive Serial (via Quartus Prime) |
| Nivel MSL | 3 (per BGA handling) |
| Estado RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes |
| Packaging | Tray |
Guía de configuración de pines de 10M25DCF256I7G 256-lbga (f256, 17x17 mm, 1.0 mm pitch)
Configuración de pines para 10M25DCF256I7G (encapsulado 256-lbga (f256, 17x17 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10M25DCF256I7G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10M25DCF256I7G es adecuado para 6 aplicacións: Industrial Motor and Motion Control, Factory Automation I/O Expansion and Bridging, Video Bridging and Display Controllers, Automotive Body Electronics, IoT Edge Sensor Aggregation, Power Conversion Digital Control.
Industrial Motor and Motion Control
The 10M25DCF256I7G is well suited for industrial motor and motion control designs because it integrates a 12-bit ADC alongside 25K logic elements and 178 user I/Os in a single non-volatile package. The ADC channels digitize current-sense amplifiers and resolver feedback without a separate analog IC, while the 25K LE fabric hosts PID loops, commutation state machines, and EtherCAT / PROFINET slave interfaces. Quartus Prime IP for motor control shortens firmware bring-up, and the industrial -40C to +100C rating handles unconditioned cabinet environments.
Recomendado
Factory Automation I/O Expansion and Bridging
The 10M25DCF256I7G acts as a flexible bridge between legacy industrial buses (RS-485, RS-232, parallel GPIO) and modern Ethernet or USB hosts in factory automation racks. With 25K LE and 178 I/Os in the F256 BGA, the device can host multi-protocol state machines, FIFOs, and timing-aware glue logic without an external processor. The non-volatile flash configuration gives deterministic power-on, which is essential for hot-swappable I/O cards that must enumerate predictably in PLC backplanes.
Recomendado
Video Bridging and Display Controllers
The 10M25DCF256I7G serves as a low-cost video bridge, converting between LVDS, MIPI, parallel RGB, and HDMI/DVI streams in embedded displays. The 178 user I/Os and LVDS support allow the F256 package to drive medium-resolution LCD panels directly, while the 25K LE fabric hosts timing controllers, color-space converters, and frame buffers in internal SRAM. The instant-on flash boot keeps display wake-up times short, which is important for kiosk and infotainment applications.
Recomendado
Automotive Body Electronics
The 10M25DCF256I7G supports automotive body-electronics modules such as body controllers, lighting drivers, and HVAC control units where mid-density logic and an integrated ADC reduce BOM. Designers can migrate to the AEC-Q100-qualified 10M25DCF256A7G in the same F256 footprint when full automotive qualification is required. The MAX 10 instant-on flash enables CAN/LIN wake-up within milliseconds of battery reconnect, which is critical for keyless-entry and alarm modules.
Recomendado
IoT Edge Sensor Aggregation
The 10M25DCF256I7G is a strong fit for IoT edge nodes that aggregate multiple analog sensors via the integrated 12-bit ADC and pre-process data in the 25K LE fabric before forwarding over Ethernet, Wi-Fi, or cellular. The non-volatile configuration lets the device wake up into a deterministic sensor-read pipeline without external boot memory. Industrial temperature rating and 178 I/Os in a 17x17 mm BGA keep the board compact enough for DIN-rail or pole-mounted enclosures.
Recomendado
Power Conversion Digital Control
The 10M25DCF256I7G implements digital control loops for AC-DC, DC-DC, and uninterruptible power supplies where the integrated ADC samples output voltage and current while the FPGA fabric runs digital PWM and compensation. The 25K LE budget is sufficient for two-loop peak-current-mode control plus housekeeping telemetry, and the 178 I/Os in the F256 BGA support multiple phase legs and fault inputs. Industrial temperature grade and non-volatile boot simplify field firmware updates via JTAG.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M25DCF256I7G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M25DCF256C8G | 10M25DCF256C7G | 10M25DCF256A7G | 10M16DCF256I7G | 10M08DCF256I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA (F256, 17x17 mm) | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same | 256-LBGA (F256) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 (-36%) | 8,000 (-68%) |
| Total RAM Bits | 691,200 | 691,200 | 691,200 | 691,200 | 500,000 approx (-28%) | 378,000 approx (-45%) |
| User I/O Pins | 178 | 178 | 178 | 178 | 178 | 178 |
| Speed / Temperature Grade | I7 (Industrial, fastest) | C8 (Commercial 0 to +85C) | C7 (Commercial, slower) | A7 (Automotive AEC-Q100) | I7 (Industrial, fastest) | I7 (Industrial, fastest) |
| Integrated ADC | Yes (12-bit, MAX 10 family) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| Pinout Compatibility | F256 reference | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) | Drop-in (same F256 pinout) |
Diferenciadores clave
- Highest industrial speed grade (I7) at 25K LE density (frente a 10M25DCF256C8G)
- Dual-configuration on-chip flash enables image-failover (frente a 10M16DCF256I7G)
- Mid-density 25K LE with full 178 I/O count in F256 (frente a 10M08DCF256I7G)
Notas de diseño
The F256 BGA uses a 1.0 mm ball pitch on a 17x17 mm body, which requires 4-layer or higher PCB stack-up with matched impedance for high-speed LVDS pairs. Use microvia or laser-drilled via-in-pad for the BGA breakout, and follow Intel's MAX 10 F256 pinout file for ball map verification. Decoupling: place 100 nF X7R caps on every VCCIO and VCCINT ball pair with vias within 1 mm of the pad.
Estimated: at full 25K LE utilization switching at 50% toggle rate, junction-to-ambient temperature rise is roughly 15-20 C/W on a JEDEC 4-layer test board. For enclosed industrial enclosures with no airflow, derate clock frequencies or add a small top-side copper pour to keep Tj below +100C. Industrial-grade parts (I7) are rated to +100C junction, so any design approaching this limit should include a thermal sensor in the FPGA fabric.
Do not mix 3.3 V LVCMOS and 1.8 V SSTL in the same I/O bank without verifying VCCIO bank voltage: each bank has a single VCCIO supply and all I/O standards in that bank must be compatible. Also, the dual-configuration flash (DC suffix) is unique to MAX 10 - it is not a generic dual-boot feature; consult the MAX 10 configuration user guide before relying on image-failover behavior in safety-critical applications.
Información de cumplimiento
RoHS and REACH compliance per Intel MAX 10 product stewardship declarations. AEC-Q100 grade available via the 10M25DCF256A7G drop-in alternative. All variants are lead-free and halogen-free.
