10M50DAF256C8G vs 10M25DAF256C8G Comparación
Comparación detallada lado a lado de 10M50DAF256C8G por Intel y 10M25DAF256C8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M50DAF256C8G | 10M25DAF256C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $47,85 | $45,30 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 49,760 (50K) | — |
| Embedded Memory (bits) | 1,677,312 | — |
| User Flash (bits) | 1,677,312 | — |
| Maximum User I/Os | 178 | — |
| Multipliers (18x18) | 312 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| On-chip ADC | 12-bit, 1 MSPS, single or dual supply | — |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Configuration | Internal flash (non-volatile, instant-on) | — |
| Speed Grade | C8 (8 ns) | C8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0 °C to 85 °C) |
| Encapsulado | 256-ball FBGA (F256) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-20) | [DATA_NEEDED: MSL level] |
| Logic Elements (LE) | — | 25,000 |
| Embedded Memory | — | 1,728 Kbits |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |