10M50DCF256C8G vs 10M40DCF256A7G Comparación
Comparación detallada lado a lado de 10M50DCF256C8G por Intel y 10M40DCF256A7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M50DCF256C8G | 10M40DCF256A7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,85 | $21,80 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 40,000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | — |
| User Flash Memory | 1,677,312 bits | — |
| DSP Blocks (18x18 Multipliers) | 172 | [DATA_NEEDED: DSP block count] |
| Maximum User I/O Pins | 178 | — |
| Encapsulado | 256-pin FBGA (FBGA256), 17x17 mm | 256-FBGA (FineLine BGA, 17 mm x 17 mm, 1.0 mm pitch) |
| Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 8 | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm |
| Core Voltage | 1.0 V (internal) | 1.2 V |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 1,290,240 (160 Kbytes) |
| Maximum User I/Os | — | 178 |
| Maximum Internal Frequency | — | 472.5 MHz |
| Embedded Memory Type | — | M9K blocks |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC Channels | — | Up to 16 (12-bit) |
| Operating Temperature Grade | — | Automotive / -40C to +125C (per Partstack grading) |
| Lead-Free / Halogen-Free | — | Yes (per device family) |