10M50DCF256C8G - MAX 10 FPGA, 50K LE, 256-BGA | Intel / Altera
N.º de pieza: 10M50DCF256C8G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $121.72 | $121,72 |
| 10 | $108.5 | $1.085,00 |
| 100 | $89.2 | $8.920,00 |
| 500 | $72.1 | $36.050,00 |
| 1.000 | $61.4 | $61.400,00 |
| 3.000 | $52.85 | $158.550,00 |
10M50DCF256C8G Descripción general
A MAX 10 FPGA is a non-volatile SRAM-based logic device with on-chip flash configuration memory. The category hierarchy places MAX 10 within programmable logic devices (PLDs), subdivided into FPGAs (Field-Programmable Gate Arrays) and CPLDs (Complex Programmable Logic Devices). MAX 10 uniquely combines FPGA fabric, on-die flash for instant-on configuration, integrated ADC blocks, and DSP/multiplier blocks in a single low-cost monolithic silicon device, occupying the bridge position between traditional CPLDs (lower density, instant-on) and Cyclone-class FPGAs (higher density, external configuration).
Key specifications of the 10M50DCF256C8G include 50,000 logic elements (LEs), 1,677,312 bits of embedded user flash, 172 18x18 multipliers, 5,151 Kbits of embedded RAM (M9K blocks), 178 general-purpose I/Os, four general-purpose PLLs, and two on-chip hard ADC blocks (12-bit, 1 MSPS). It is fabricated on TSMC 55 nm embedded flash CMOS process technology with 1.0V core and 2.5V/3.3V LVCMOS-compatible I/O banks. The device supports instant-on from on-die flash and dual-boot configuration modes for fail-safe field updates.
The 10M50DCF256C8G targets industrial, automotive, and consumer applications that require non-volatile configuration, low standby power, and integrated analog. Because configuration is stored on-chip, the device needs no external boot PROM, simplifying PCB layout, lowering BOM cost, and reducing susceptibility to configuration memory corruption during in-field firmware updates. The integrated ADC eliminates an external ADC IC in many motor control and sensor-interface designs, and the dual-boot mode enables A/B firmware images for OTA-capable industrial systems.
Typical applications include industrial motor control drives, factory automation I/O modules, portable medical instrumentation, automotive infotainment and ADAS pre-processing, low-cost video processing, I/O expansion bridges for microcontrollers, and replacement of legacy CPLD designs that have outgrown their density. Design considerations include using all four PLL outputs for jitter-sensitive clock domains, observing the FBGA256 PCB escape routing guidelines, and ensuring JTAG signal integrity for in-system programming.
Alternativas directas para 10M50DCF256C8G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M50DCF256C8G (mismo factor de forma y huella) — difiere en Package, Speed Grade, Logic Elements (LE), Process Technology, Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M50DCF256C7G
✅ Sustitución directa✓ En stock
$98 / unidad
Ver hoja de datos →10M50DCF256A7G
✅ Sustitución directa✓ En stock
$29.8 / unidad
Ver hoja de datos →10M40DCF256C8G
✅ Sustitución directa✓ En stock
$71.8 / unidad
Ver hoja de datos →10M40DCF256C7G
✅ Sustitución directa✓ En stock
$26.4 / unidad
Ver hoja de datos →10M40DCF256I7G
✅ Sustitución directa✓ En stock
$52.12 / unidad
Ver hoja de datos →10M40DCF256A7G
✅ Sustitución directa✓ En stock
$21.8 / unidad
Ver hoja de datos →10M50DCF256C8G Valores máximos y características eléctricas
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) |
| User Flash Memory | 1,677,312 bits |
| DSP Blocks (18x18 Multipliers) | 172 |
| Maximum User I/O Pins | 178 |
| Encapsulado | 256-pin FBGA (FBGA256), 17x17 mm |
| Temperature Grade | Commercial (C suffix) |
| Speed Grade | 8 |
| PLLs | 4 |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) |
| Process Technology | TSMC 55 nm embedded flash CMOS |
| Core Voltage | 1.0 V (internal) |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
Guía de configuración de pines de 10M50DCF256C8G 256-pin fbga (fbga256), 17x17 mm
Configuración de pines para 10M50DCF256C8G (encapsulado 256-pin fbga (fbga256), 17x17 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10M50DCF256C8G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10M50DCF256C8G es adecuado para 8 aplicacións: Industrial Motor Control Drive, Factory Automation I/O Module, Portable Medical Instrumentation, Automotive Infotainment and ADAS Pre-Processing, Low-Cost Video Processing Bridge, Microcontroller I/O Expansion and Glue Logic, CPLD Replacement for High-Density Designs, IoT Edge Sensor Aggregation Gateway.
Industrial Motor Control Drive
The 10M50DCF256C8G is ideal for industrial motor control drives, where its integrated 12-bit 1 MSPS ADC blocks directly sample motor phase currents and DC bus voltages without external analog ICs. With 172 18x18 multipliers and 50K LEs, the device can implement field-oriented control (FOC) loops, space-vector PWM, and encoder feedback processing in a single chip. The 178 user I/O pins accommodate three-phase PWM outputs, quadrature encoder interfaces, CAN, RS-485, and parallel LCD HMI buses simultaneously, reducing BOM cost by eliminating multiple CPLDs and ADCs.
Recomendado
Factory Automation I/O Module
In factory automation I/O modules the 10M50DCF256C8G serves as a protocol-aggregation FPGA, handling industrial EtherCAT, PROFINET, or Modbus TCP I/O mapping. Its on-die 1.677 Mb user flash stores firmware revision stamps and calibration data for the I/O module's analog channels, while 172 DSP blocks implement digital filtering on incoming sensor data. The instant-on capability from non-volatile flash ensures the module enters the EtherCAT network in milliseconds after power-up, a critical requirement for hot-swappable industrial I/O racks.
Recomendado
Portable Medical Instrumentation
The 10M50DCF256C8G suits portable medical instrumentation such as patient monitors and handheld ultrasound probes, where its integrated 12-bit ADCs directly digitize ECG, SpO2, or doppler ultrasound signals. The dual-configuration flash supports fail-safe A/B firmware updates required by FDA 510(k) medical device certification. The 50K LEs enable on-chip signal processing pipelines including FFT, digital filtering, and envelope detection, while the FBGA256 17x17 mm package fits within the compact form factor of handheld medical carts.
Recomendado
Automotive Infotainment and ADAS Pre-Processing
For automotive infotainment and ADAS sensor pre-processing the 10M50DCF256C8G (or its automotive-grade variant 10M50DCF256A7G) aggregates multiple camera, radar, and CAN-FD data streams. The 172 DSP blocks handle real-time image scaling, color space conversion, and digital filtering of radar IF signals, while 178 I/O pins connect to LVDS camera serializers and MIPI CSI-2 deserializers. The instant-on from on-die flash enables the ADAS camera to be ready within 100 ms of ignition, a critical requirement for surround-view systems.
Recomendado
Low-Cost Video Processing Bridge
The 10M50DCF256C8G functions as a low-cost video processing bridge between HDMI/MIPI CSI-2 camera inputs and parallel RGB or LVDS displays in digital signage and kiosk applications. Its 50K LEs implement color space conversion (YUV422 to RGB888), frame-rate conversion, and on-screen display (OSD) blending without external memory thanks to the on-chip M9K RAM. The 178 I/O pins accept 24-bit parallel camera data plus control signals, while the integrated ADCs can sample ambient light sensors for automatic display brightness adjustment.
Recomendado
Microcontroller I/O Expansion and Glue Logic
The 10M50DCF256C8G is widely used as I/O expansion and glue logic for microcontrollers that lack sufficient pins or peripheral channels. It bridges between low-pin-count microcontrollers and high-bandwidth parallel peripherals such as SDRAM, LCDs, or high-speed ADCs, offloading real-time tasks via SPI or parallel interfaces. Its on-die user flash can store boot images for the host microcontroller, while the dual-configuration flash allows in-field firmware updates of both the FPGA bitstream and the host MCU firmware stored in FPGA user flash.
Recomendado
CPLD Replacement for High-Density Designs
Designers transitioning from legacy CPLDs (such as Altera MAX V or MAX II) to higher-density logic can move to the 10M50DCF256C8G when CPLD resources are exhausted. The MAX 10's instant-on, non-volatile configuration is CPLD-compatible, but it adds 50K LEs of additional capacity along with DSP blocks, embedded RAM, and ADCs not available in CPLDs. Migration paths from MAX II/MAX V to MAX 10 are supported by Quartus Prime's library migration tools, and pin-compatible FBGA packages ease the transition.
Recomendado
IoT Edge Sensor Aggregation Gateway
The 10M50DCF256C8G aggregates multiple IoT sensor interfaces (I2C, SPI, UART, GPIO) in industrial edge gateways, offloading the host processor by handling protocol translation and data buffering. Its on-die 1.677 Mb user flash stores authentication keys, device certificates, and Modbus/EtherCAT node descriptors required by IIoT security frameworks. The integrated ADCs monitor board-level voltages and temperatures for predictive maintenance, while 50K LEs implement hardware-accelerated MQTT-SN or OPC-UA message framing at line rate.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M50DCF256C8G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M50DCF256C7G | 10M50DCF256A7G | 10M40DCF256C8G | 10M40DCF256C7G |
|---|---|---|---|---|---|
| Package | FBGA-256 (F256), 17x17 mm | FBGA-256 (F256), 17x17 mm - same | FBGA-256 (F256), 17x17 mm - same | FBGA-256 (F256), 17x17 mm - same | FBGA-256 (F256), 17x17 mm - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,000 | 50,000 (same) | 50,000 (same) | 40,000 (-20%) | 40,000 (-20%) |
| Speed Grade | -8 (faster) | -7 (slower) | -7 (slower) | -8 (same) | -7 (slower) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (same) | Automotive (-40C to +125C) | Commercial (same) | Commercial (same) |
| User Flash | 1,677,312 bits | 1,677,312 bits (same) | 1,677,312 bits (same) | 1,290,240 bits (-23%) | 1,290,240 bits (-23%) |
| DSP Blocks (18x18) | 172 | 172 (same) | 172 (same) | 125 (-27%) | 125 (-27%) |
| User I/O | 178 | 178 (same) | 178 (same) | 178 (same) | 178 (same) |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
Diferenciadores clave
- Higher Fmax (speed grade -8) within same FBGA256 footprint (frente a 10M50DCF256C7G)
- Higher logic element density within same FBGA256 package (frente a 10M40DCF256C8G)
- Non-volatile configuration flash eliminates external boot PROM (frente a Cyclone IV E (e.g., EP4CE30F256))
Notas de diseño
The 10M50DCF256C8G's FBGA256 package requires 0.8 mm ball pitch and 17x17 mm body. Use 4 to 6 PCB layers with at least 2 inner layers dedicated to GND and 1 to 2 inner layers for power (1.0V core, 2.5V/3.3V I/O banks). Each VCCINT/VCCIO pin pair should have a 0.1 uF decoupling capacitor placed within 100 mils of the package via. Avoid routing high-speed signals (LVDS, DDR) under the BGA shadow; route differential pairs on adjacent signal layers with matched lengths within 10 mils.
For DDR3 interfaces implemented in MAX 10, follow Intel's EMIF pin assignment guidelines carefully. The -8 speed grade is required for DDR3-400 (200 MHz) operation; the -7 speed grade only supports DDR3-333 (167 MHz). Match DQ/DQS trace lengths to within +/-25 mils, and use source-synchronous termination on DQS pairs. Use the Quartus Prime Timing Analyzer to validate setup/hold margins after place-and-route.
Power sequencing: VCCINT (1.0V) must reach 0.95V before VCCAUX and VCCIO rails start ramping. If rails can power up out of order, add a sequencer IC (e.g., ADM1184) or use the MAX 10's POR (power-on-reset) feature. Estimated: at 50% LE utilization and 50 MHz toggle rate, core current is approximately 350 mA; at full utilization with 200 MHz DSP activity, plan for 700-900 mA. Use a switching regulator with at least 30% headroom over peak current for thermal reliability.
Do not configure the JTAG pins as user I/O unless the design explicitly needs no JTAG access - this prevents later in-system programming. The two hard ADC blocks require a separate 2.5V analog supply (VCCA_ADC) decoupled with both 10 uF bulk and 0.1 uF ceramic capacitors; shared digital 2.5V will couple switching noise into the ADC results. For dual-boot mode, ensure CFM0 and CFM1 are configured identically before enabling A/B switching.
Estimated: at maximum LE utilization and continuous DSP activity, the FBGA256 package dissipates approximately 1.5 to 2.5 W. The junction-to-ambient thermal resistance (theta_JA) for FBGA256 with standard JEDEC test board (4-layer, 0 air flow) is approximately 18 C/W, resulting in a junction temperature rise of 27 to 45 C above ambient. For commercial-temperature (0C to +85C) operation, no heatsink is needed; for industrial or automotive temperature grades, ensure adequate PCB copper thermal relief (thermal vias under the package, ground plane on inner layers).
Información de cumplimiento
RoHS and REACH compliance per Intel product page. Commercial temperature grade only; choose 10M50DCF256A7G for AEC-Q100 automotive qualification. Halogen-free per JEDEC JS709B.
