5CGXBC9C6F23C7N vs 5CGXBC9A7U19C8N Comparación
Comparación detallada lado a lado de 5CGXBC9C6F23C7N por Intel y 5CGXBC9A7U19C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 5CGXBC9C6F23C7N | 5CGXBC9A7U19C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $334,20 | $219,75 |
| Family | Cyclone V GX | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) | — |
| Logic Elements | 301,000 | — |
| Embedded Memory | 13,917 Kbit | — |
| Number of GPIO | 224 | — |
| Number of Transceivers | 6 | — |
| Transceiver Data Rate | 3.125 Gbps | — |
| Core Supply Voltage | 1.13 V (typ) | — |
| Process Technology | TSMC 28 nm low-power | — |
| Maximum Operating Frequency | 800 MHz | — |
| Encapsulado | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (UBGA-19) |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial, suffix 7) | 0C to 85C (commercial) |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant |
| Tape & Reel Quantity | 60 (per FindIC) | — |
| Tipo de memoria | SRAM-based configuration | — |
| Logic Elements (LE) | — | 301,000 |
| Embedded Memory (bits) | — | 14,251,008 |
| DSP Blocks | — | 240 |
| Transceivers | — | 6 channels, up to 3.125 Gbps |
| Hard PCIe Gen2 Blocks | — | Yes |
| User I/O | — | 560 |
| Process Node | — | TSMC 28 nm low-power |
| Speed Grade | — | 8 |
| Configuration Modes | — | JTAG, AS, PS |
| External Memory Support | — | DDR2, DDR3, LPDDR2 |
| Supply Voltage (core) | — | [DATA_NEEDED: core supply voltage] |