5CGXBC9C6F23C7N vs 5CGXBC9C7F23C8N Comparación
Comparación detallada lado a lado de 5CGXBC9C6F23C7N por Intel y 5CGXBC9C7F23C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 5CGXBC9C6F23C7N | 5CGXBC9C7F23C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $334,20 | $54,80 |
| Family | Cyclone V GX | Cyclone V GX |
| Series | 5CGXBC9 (9-series, 6 transceivers) | — |
| Logic Elements | 301,000 | — |
| Embedded Memory | 13,917 Kbit | — |
| Number of GPIO | 224 | — |
| Number of Transceivers | 6 | — |
| Transceiver Data Rate | 3.125 Gbps | — |
| Core Supply Voltage | 1.13 V (typ) | — |
| Process Technology | TSMC 28 nm low-power | 28 nm TSMC low-power |
| Maximum Operating Frequency | 800 MHz | — |
| Encapsulado | 484-ball FBGA (F23, 23x23 mm) | 484-ball FBGA (F23, 23x23 mm, 1.0 mm pitch) |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial, suffix 7) | 0 C to +85 C (commercial, 'C' speed grade) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant (Pb-free) |
| Tape & Reel Quantity | 60 (per FindIC) | — |
| Tipo de memoria | SRAM-based configuration | — |
| Logic Elements (LE) | — | 301,000 |
| Embedded Memory Bits | — | 14,251,008 (9.4 Mbit) |
| User I/O Pins | — | 224 |
| Core Voltage | — | 1.1 V |
| Speed Grade | — | 8 (C8) |
| Hard Memory Controllers | — | 2 (DDR3, DDR2, LPDDR2) |
| PLLs | — | 4 |
| Embedded Multipliers (18x19) | — | 156 |
| Transceivers | — | Up to 9 channels, 3.125 Gbps |
| PCIe Hard IP | — | Gen2 x4 (1 hard IP block) |
| Nivel MSL | — | 3 (168 hours) |