5CSEBA4U23C7SN vs 5CSEBA4U23C7N Comparación
Comparación detallada lado a lado de 5CSEBA4U23C7SN por Intel y 5CSEBA4U23C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ ActivoIntel
5CSEBA4U23C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7N ✓ ActivoComparación de especificaciones
| Parámetro | 5CSEBA4U23C7SN | 5CSEBA4U23C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,20 | $124,50 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | 224 |
| Maximum User I/Os | 364 | — |
| Encapsulado | 672-ball UBGA, 23x23 mm | 672-ball UBGAs (UBGA), 23x23 mm |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | Commercial 0C to +85C (C7 speed grade) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | — |
| Speed Grade | C7 | — |
| Estado RoHS | Compliant | Compliant |
| Device Variant | — | 5CSEA4 (Logic Element density) |
| Logic Elements | — | 40,000 |
| HPS Maximum Core Frequency | — | 800 MHz |
| Embedded Memory | — | Approximately 2.7 Mbits (M10K + M9K) |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 364 |
| High-Speed Transceivers | — | 6 (up to 3.125 Gbps) |
| PCIe Hard IP | — | 2 Gen2 blocks |
| Tipo de montaje | — | Surface Mount (BGA) |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Memory Interface | — | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) |