5CSEBA4U23C7SN vs 5CSEBA4U23C7N Comparaison
Comparaison détaillée côte à côte de 5CSEBA4U23C7SN par Intel et 5CSEBA4U23C7N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ ActifIntel
5CSEBA4U23C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7N ✓ ActifComparaison des spécifications
| Paramètre | 5CSEBA4U23C7SN | 5CSEBA4U23C7N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $18,20 | $124,50 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | 224 |
| Maximum User I/Os | 364 | — |
| Boîtier | 672-ball UBGA, 23x23 mm | 672-ball UBGAs (UBGA), 23x23 mm |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Température de fonctionnement | -40C to +85C (industrial) | Commercial 0C to +85C (C7 speed grade) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | — |
| Speed Grade | C7 | — |
| Statut RoHS | Compliant | Compliant |
| Device Variant | — | 5CSEA4 (Logic Element density) |
| Logic Elements | — | 40,000 |
| HPS Maximum Core Frequency | — | 800 MHz |
| Embedded Memory | — | Approximately 2.7 Mbits (M10K + M9K) |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 364 |
| High-Speed Transceivers | — | 6 (up to 3.125 Gbps) |
| PCIe Hard IP | — | 2 Gen2 blocks |
| Type de montage | — | Surface Mount (BGA) |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Memory Interface | — | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) |