A3P1000-2FG256M vs A3P1000-FG256M Comparación
Comparación detallada lado a lado de A3P1000-2FG256M por Microchip Technology y A3P1000-FG256M por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
A3P1000-2FG256M ✓ ActivoMicrochip Technology
A3P1000-FG256M - ProASIC3 Flash FPGA 1M Gates 256-FBGA | Microchip
A3P1000-FG256M ✓ ActivoComparación de especificaciones
| Parámetro | A3P1000-2FG256M | A3P1000-FG256M |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $45,10 | $50,87 |
| Family | ProASIC3 | ProASIC3 |
| Logic Elements | 11000 LE | — |
| Number of I/Os | 177 I/O | — |
| System Frequency | 310 MHz | — |
| Technology | 130 nm CMOS, flash-based | CMOS flash-based FPGA |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Speed Grade | 2 | — |
| Encapsulado / Carcasa | FBGA-256 (256-LBGA) | — |
| Estilo de montaje | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +85 C | — |
| Packaging | Tray | — |
| Programmability | Reprogrammable, non-volatile flash | In-system reprogrammable, non-volatile flash |
| I/O Banks | 4 banks (banked VCCIB) | 4 |
| Configuration | Single-chip, instant-on (no external config PROM) | Single-chip, instant-on (no external boot ROM) |
| Series | A3P1000 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| System Gates | — | 1000000 gates |
| VersaTiles (Logic Elements) | — | 24576 |
| User I/O | — | 177 |
| Configuration Memory | — | 147456 bits flash |
| Maximum System Performance | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| I/O Supply Voltage (VCCIBx) | — | [DATA_NEEDED: I/O bank voltage range] |
| Architecture | — | VersaTile (3-input LUT / D-flip-flop / latch) |
| Soft Processor Support | — | Optional soft ARM support |
| Encapsulado | — | 256-LBGA (FBGA-256) |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |