A3P1000L-1FG256 vs A3P1000-1FG256T Comparación
Comparación detallada lado a lado de A3P1000L-1FG256 por Microchip Technology y A3P1000-1FG256T por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P1000L-1FG256 - ProASIC3L Flash FPGA 1M Gates | Microchip
A3P1000L-1FG256 ✓ ActivoMicrochip Technology
A3P1000-1FG256T - ProASIC3 FPGA 1M Gates 177 I/O | Microchip
A3P1000-1FG256T ✓ ActivoComparación de especificaciones
| Parámetro | A3P1000L-1FG256 | A3P1000-1FG256T |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $38,90 | $89,64 |
| Family | ProASIC3L (Flash FPGA) | ProASIC3 |
| System Gates | 1,000,000 | 1000000 gates |
| Logic Elements (VersaTiles) | 24,576 | — |
| User I/Os | 177 | — |
| Embedded SRAM | 147,456 bits | — |
| Core Voltage (L grade) | 1.2 V (1.2 V to 1.5 V supported) | — |
| Speed Grade | -1 | -1 |
| Frecuencia de reloj máxima | [DATA_NEEDED: verified fMAX for -1 grade] | — |
| Technology | Nonvolatile flash, CMOS | — |
| Configuration Memory | On-chip flash (single-chip, Instant-On) | — |
| Low Power Feature | Flash*Freeze technology | — |
| Encapsulado | 256-ball FBGA (FG256), 17 x 17 mm, 1.0 mm pitch | 256-LBGA (FBGA-256), 1 mm pitch |
| Package Height | 1.6 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Estado RoHS | Compliant | — |
| Logic Technology | — | Flash-based FPGA |
| VersaTiles / Cells | — | 24576 |
| User I/O | — | 177 |
| Embedded Configuration Flash | — | 147456 bits |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Configuration | — | Non-volatile, single-chip, instant-on |
| Reprogrammability | — | Yes (in-system reprogrammable flash) |
| Security Features | — | Flash lock, design protection from cloning |
| Temperature Grading | — | Automotive (per distributor data) |
| AEC-Q100 | — | Qualified (per Utmel listing) |
| Packing | — | Tape & Reel (T suffix) |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| Nivel MSL | — | [DATA_NEEDED: moisture sensitivity level] |