A3P1000-1FG256T - ProASIC3 FPGA 1M Gates 177 I/O | Microchip
N.º de pieza: A3P1000-1FG256T ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $112.06 | $112,06 |
| 10 | $106.46 | $1.064,60 |
| 100 | $100.85 | $10.085,00 |
| 500 | $95.25 | $47.625,00 |
| 1.000 | $89.64 | $89.640,00 |
A3P1000-1FG256T Descripción general
A flash FPGA is a type of field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external SRAM configuration device. Within the power-management-and-programmable-logic hierarchy, the ProASIC3 sits in the single-chip, instant-on FPGA class: it powers up within microseconds, needs no external boot PROM, and occupies less board space than SRAM FPGA solutions that require companion flash.
Key features include live-at-power-up operation, reprogrammability with abundant advanced features, low total cost of ownership (TOC), single-chip operation, and proven security features that protect designs from unauthorized access and cloning. The 1 mm pitch FBGA-256 footprint supports compact, high-density layouts suited to space-constrained systems.
Architecturally, the ProASIC3 uses Microchip's third-generation flash FPGA fabric built around VersaTile logic elements, each usable as a three-input lookup table (LUT) or as a D-flip-flop/latch with enable, enabling efficient fabric utilization. Flash-based configuration also mitigates the need for ASIC migration at higher volumes, making the family a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets. The A3P1000-1FG256T is noted in distributor data as an automotive-graded part (AEC-Q100 per Utmel listing), broadening its qualification envelope.
Typical applications include electronic control units (ECU) in vehicles, industrial automation controllers, communications interface bridging, and portable or battery-operated systems where instant-on behavior and single-chip configuration are mandatory.
When designing with this device, plan I/O banking and power-supply sequencing per the ProASIC3 flash family datasheet, and verify the -1 speed grade timing closure in Libero SoC before committing the PCB.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para A3P1000-1FG256T — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3P1000-1FG256T (mismo factor de forma y huella) — difiere en Package, Technology, System Gates, Configuration, Maximum System Performance.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3P1000-1FGG256T
✅ Sustitución directa✓ En stock
$112.06 / unidad
Ver hoja de datos →A3P1000-FGG256M
✅ Sustitución directa✓ En stock
$27.85 / unidad
Ver hoja de datos →A3P1000-FG256M
✅ Sustitución directa✓ En stock
$50.87 / unidad
Ver hoja de datos →A3P1000-FG256I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
A3P1000-FG144T
✅ Sustitución directa✓ En stock
$27.2 / unidad
Ver hoja de datos →A3P1000-1FG256T Valores máximos y características eléctricas
| Family | ProASIC3 |
| Logic Technology | Flash-based FPGA |
| System Gates | 1000000 gates |
| VersaTiles / Cells | 24576 |
| User I/O | 177 |
| Embedded Configuration Flash | 147456 bits |
| Speed Grade | -1 |
| Encapsulado | 256-LBGA (FBGA-256), 1 mm pitch |
| Terminal Form | Ball |
| Package Shape | Square |
| Tipo de montaje | Surface Mount |
| Configuration | Non-volatile, single-chip, instant-on |
| Reprogrammability | Yes (in-system reprogrammable flash) |
| Security Features | Flash lock, design protection from cloning |
| Temperature Grading | Automotive (per distributor data) |
| AEC-Q100 | Qualified (per Utmel listing) |
| Packing | Tape & Reel (T suffix) |
Guía de configuración de pines de A3P1000-1FG256T square
Configuración de pines para A3P1000-1FG256T (encapsulado square). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3P1000-1FG256T.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3P1000-1FG256T es adecuado para 6 aplicacións: Automotive Electronic Control Units, Industrial Automation Controllers, Networking and Communications Equipment, Consumer Electronics and ASIC Replacement, Avionics and Secure Systems, Computing and Board-Level Glue Logic.
Automotive Electronic Control Units
The A3P1000-1FG256T fits automotive ECU designs because it combines flash-based instant-on operation with automotive qualification (AEC-Q100 per Utmel listing). In an ECU, the FPGA must be live before the microcontroller boots to manage power sequencing, sensor gating, and fail-safe paths; the ProASIC3's on-chip flash configuration activates within microseconds of supply application, unlike SRAM FPGAs that wait for external bitstream loading. With 24,576 VersaTiles and 177 user I/Os, it integrates glue logic, CAN/LIN bridge functions, and diagnostics in one chip. The FBGA-256 package at 1 mm pitch keeps board area compact in the ECU enclosure, while flash lock security prevents cloning of proprietary control algorithms.
Recomendado
Industrial Automation Controllers
Industrial controllers benefit from the A3P1000-1FG256T's reprogrammability and single-chip integration: one ProASIC3 device replaces multiple ASSPs and glue logic for I/O expansion, encoder interfacing, and backplane bridging. The 1,000,000-gate fabric and 177 user I/Os provide headroom for protocol translation and timing-critical interlocks, while non-volatile flash configuration means the controller is functional immediately at power-up - important for machines that must resume safe states after brownouts. Low total cost of ownership and the ability to field-update logic protect long industrial product lifecycles. According to the ProASIC3 datasheet, the family's ASIC-migration path also de-risks volume production when demand outgrows FPGA sourcing.
Recomendado
Networking and Communications Equipment
In networking and communications systems, the A3P1000-1FG256T serves as an interface bridge, line-card sequencer, and control-plane fabric. The -1 speed grade ProASIC3 fabric handles moderate-throughput data paths, while 177 user I/Os cover multiple I/O banks for connecting MACs, PHYs, and backplane connectors. Flash configuration with design security (flash lock) protects proprietary packet-processing algorithms from extraction - a differentiator versus SRAM FPGA bitstreams read from external flash at each boot. Instant-on behavior lets the FPGA manage hot-swap and bring-up sequencing of line cards before software loads. The square FBGA-256 footprint supports high-layer-count communication boards with controlled-impedance breakout routing.
Recomendado
Consumer Electronics and ASIC Replacement
Microchip positions ProASIC3 explicitly as a cost-effective ASIC replacement for consumer applications, and the A3P1000-1FG256T is the mid-density point of that value proposition: low total cost of ownership, small footprint packages, and no NRE charges. The 24,576-VersaTile fabric implements custom interfaces, display controllers, and sensor-hub logic that would otherwise require an ASIC, with the flexibility to revise the design in-house. Single-chip flash configuration eliminates the external boot flash BOM item, and reprogrammability absorbs late feature changes that would be catastrophic on a mask ASIC. For consumer products moving to higher volumes, the family architecture mitigates the need for ASIC migration.
Recomendado
Avionics and Secure Systems
The ProASIC3 family datasheet explicitly targets the avionics market, and the A3P1000-1FG256T contributes the qualities avionics designers require: non-volatile, single-chip configuration with no external boot device to fail, instant-on logic for power-up built-in-test, and flash-based design security against tampering and cloning. The 1M-gate fabric integrates sensor aggregation, ARINC-style protocol handling, and monitor logic around a main flight processor. Reprogrammability supports fleet retrofits and configuration management without hardware changes. Designers should confirm the specific temperature grade and screening level of the ordering suffix against program requirements, using the manufacturer datasheet package tables for the FG256 ball map.
Recomendado
Computing and Board-Level Glue Logic
In computing platforms - storage controllers, blade servers, and industrial PCs - the A3P1000-1FG256T consolidates board management: power-supply sequencing, fan control interfaces, I2C/SPI multiplexing, hot-plug handling, and voltage-monitor logic. The 177 user I/Os connect across multiple power domains, and instant-on flash configuration lets the FPGA enforce sequencing rules before CPUs or ASICs power up. Using a single reprogrammable device instead of fixed ASSPs simplifies ECOs and platform derivatives. At a unit price of roughly $112 as of 2026-08-31, it is cost-effective where discrete management logic or smaller CPLDs would require multiple devices and repeated respins.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3P1000-1FG256T — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3P1000-1FGG256T | A3P1000-FGG256M | A3P1000-FG256M |
|---|---|---|---|---|
| Package | 256-LBGA (FG256), 1 mm pitch | 256-LBGA (FGG256) - same footprint | 256-LBGA (FGG256) - same footprint | 256-LBGA (FG256) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1000000 gates | 1000000 gates | 1000000 gates | 1000000 gates |
| VersaTiles | 24576 | 24576 | 24576 | 24576 |
| User I/O | 177 | 177 | 177 | 177 |
| Configuration | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Diferenciadores clave
- Flash-based single-chip configuration (frente a A3P1000-FG256M)
- Identical footprint in green-package variant (frente a A3P1000-1FGG256T)
- Automotive qualification path (frente a A3P1000-FG256I)
Notas de diseño
The 256-ball FBGA at 1 mm pitch requires controlled-impedance breakout: escape fanout on inner layers with via-in-pad or dog-bone patterns, and follow Microchip's ProASIC3 PCB layout guidelines for ball assignment per I/O bank. Verify the exact FG256 land pattern from the datasheet mechanical drawing before fab release, since FG and FGG package finish variants share the footprint but confirm solder-mask defined pad dimensions from the latest datasheet revision.
Estimated: derive total core current from Libero SoC power analysis for your utilization, not from family typical values, since 24,576 VersaTiles at toggle activity can span a wide current range. Provide independent, well-decoupled core and I/O bank supplies with bulk capacitance at each bank, and respect the datasheet power-up ramp-rate requirement so the on-chip flash configuration completes correctly at every power cycle.
Do not substitute across speed grades without re-running timing closure: the -1 grade defines the fabric performance ceiling of this MPN, and default-grade variants (e.g., A3P1000-FG256M) may differ. Also confirm the exact ordering suffix temperature grade against your program requirements - automotive/AEC-Q100 status is claimed per distributor listings, but formal automotive programs should obtain the qualification certificate for the exact part number.
Información de cumplimiento
Utmel lists A3P1000-1FG256T as automotive, AEC-Q100, ProASIC3 Series. RoHS/REACH/lead-free status per exact ordering suffix must be confirmed from the Microchip product page certificate of compliance.
