A3P600-2FG256I vs A3P600-1FGG256I Comparación
Comparación detallada lado a lado de A3P600-2FG256I por Microchip Technology y A3P600-1FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip
A3P600-2FG256I ✓ ActivoMicrochip Technology
A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip
A3P600-1FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-2FG256I | A3P600-1FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $44,40 | $16,19 |
| Manufacturer Series | ProASIC3 (A3P600) | — |
| Logic Elements (LEs) | 7K LEs (approximately) | — |
| Configuration Memory | 110592 bits (flash, non-volatile) | — |
| Number of I/Os | 177 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5V |
| Speed Grade | -2 | — |
| Temperature Range | -40C to +85C (industrial, suffix I) | — |
| Encapsulado | 256-FBGA (LBGA) | — |
| Estilo de montaje | SMD/SMT | — |
| Configuration Technology | Flash (single-chip, no external PROM) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Power-up Behavior | Live at power-up (instant-on) | — |
| I/O Banks | 4 I/O banks with dedicated VCCIBx supplies | — |
| Logic Architecture | VersaTile (3-input LUT / D-FF / latch with enable) | — |
| Estado RoHS | [DATA_NEEDED: RoHS Status] | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Family | — | ProASIC3 |
| Number of Logic Elements/Cells | — | 7KLEs |
| Total RAM Bits | — | 110592 |
| Number of I/O | — | 177 |
| Number of Gates | — | 600K |
| Voltage - Supply | — | 1.425V ~ 1.575V |
| Tipo de montaje | — | Surface Mount |
| Encapsulado / Carcasa | — | 256-LBGA |
| Supplier Device Package | — | 256-FBGA |
| Temperatura de funcionamiento | — | -40°C ~ 100°C (TJ) |
| Maximum Operating Frequency | — | 272 MHz |
| Technology | — | 130nm |
| Number of I/O Banks | — | [DATA_NEEDED: Number of I/O Banks] |
| Embedded Memory | — | 110592 bits |