A3P600-2FG256I vs A3P600-1FGG256I Comparaison
Comparaison détaillée côte à côte de A3P600-2FG256I par Microchip Technology et A3P600-1FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip
A3P600-2FG256I ✓ ActifMicrochip Technology
A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip
A3P600-1FGG256I ✓ ActifComparaison des spécifications
| Paramètre | A3P600-2FG256I | A3P600-1FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $44,40 | $16,19 |
| Manufacturer Series | ProASIC3 (A3P600) | — |
| Logic Elements (LEs) | 7K LEs (approximately) | — |
| Configuration Memory | 110592 bits (flash, non-volatile) | — |
| Number of I/Os | 177 I/O | — |
| Core Supply Voltage | 1.5 V | 1.5V |
| Speed Grade | -2 | — |
| Temperature Range | -40C to +85C (industrial, suffix I) | — |
| Boîtier | 256-FBGA (LBGA) | — |
| Style de montage | SMD/SMT | — |
| Configuration Technology | Flash (single-chip, no external PROM) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Power-up Behavior | Live at power-up (instant-on) | — |
| I/O Banks | 4 I/O banks with dedicated VCCIBx supplies | — |
| Logic Architecture | VersaTile (3-input LUT / D-FF / latch with enable) | — |
| Statut RoHS | [DATA_NEEDED: RoHS Status] | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Family | — | ProASIC3 |
| Number of Logic Elements/Cells | — | 7KLEs |
| Total RAM Bits | — | 110592 |
| Number of I/O | — | 177 |
| Number of Gates | — | 600K |
| Voltage - Supply | — | 1.425V ~ 1.575V |
| Type de montage | — | Surface Mount |
| Boîtier / Format | — | 256-LBGA |
| Supplier Device Package | — | 256-FBGA |
| Température de fonctionnement | — | -40°C ~ 100°C (TJ) |
| Maximum Operating Frequency | — | 272 MHz |
| Technology | — | 130nm |
| Number of I/O Banks | — | [DATA_NEEDED: Number of I/O Banks] |
| Embedded Memory | — | 110592 bits |