A3P600-2FGG144 vs A3P1000-1FGG144T Comparación
Comparación detallada lado a lado de A3P600-2FGG144 por Microsemi y A3P1000-1FGG144T por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3P1000-1FGG144T - ProASIC3 FPGA, 1M Gates | Microchip
A3P1000-1FGG144T ✓ ActivoComparación de especificaciones
| Parámetro | A3P600-2FGG144 | A3P1000-1FGG144T |
|---|---|---|
| Marca | Microsemi | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $30,40 | $75,00 |
| Family | ProASIC3 | ProASIC3 |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| Encapsulado | 144-Ball FBGA (FGG144) | — |
| Ball Pitch | 1 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40°C to +125°C |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Number of Logic Elements | — | 11K LEs |
| Number of Gates | — | 1000000 |
| Total RAM Bits | — | 147456 |
| Number of I/O | — | 97 |
| Tensión de alimentación | — | 1.425V to 1.575V |
| Encapsulado / Carcasa | — | 144-LBGA |
| Supplier Device Package | — | 144-FPBGA (13x13) |
| Grade | — | Automotive |
| Differential I/O Standards | — | LVPECL, LVDS, B-LVDS, M-LVDS |
| Number of CCC Blocks | — | 6 |
| Number of PLLs | — | 1 |