A3P600-2FGG144 vs A3P1000-1FGG144T 对比
详细并排对比 A3P600-2FGG144 出自 Microsemi 和 A3P1000-1FGG144T 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | A3P600-2FGG144 | A3P1000-1FGG144T |
|---|---|---|
| 品牌 | Microsemi | Microchip Technology |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $30.40 | $75.00 |
| Family | ProASIC3 | ProASIC3 |
| Equivalent Gate Count | 600000 gates | — |
| Logic Cells (CLBs) | 13824 CLBs | — |
| User I/O | 97 I/O | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Voltage | 1.5 V | — |
| Program Technology | Nonvolatile Flash | — |
| 封装 | 144-Ball FBGA (FGG144) | — |
| Ball Pitch | 1 mm | — |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Speed Grade | -2 | — |
| Configuration | Single-chip, Instant On, no external boot device | — |
| I/O Banks | 4 (independently supplied VCCIB banks) | — |
| Embedded Memory | [DATA_NEEDED: embedded RAM bits] | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -40°C to +125°C |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | — |
| Number of Logic Elements | — | 11K LEs |
| Number of Gates | — | 1000000 |
| Total RAM Bits | — | 147456 |
| Number of I/O | — | 97 |
| 电源电压 | — | 1.425V to 1.575V |
| 封装 / 外壳 | — | 144-LBGA |
| Supplier Device Package | — | 144-FPBGA (13x13) |
| Grade | — | Automotive |
| Differential I/O Standards | — | LVPECL, LVDS, B-LVDS, M-LVDS |
| Number of CCC Blocks | — | 6 |
| Number of PLLs | — | 1 |