A3P600-FGG484I vs A3P600-FG484 Comparación

Comparación detallada lado a lado de A3P600-FGG484I por Microchip Technology y A3P600-FG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3P600-FGG484I A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip

A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip

A3P600-FGG484I ✓ Activo
Microchip Technology
A3P600-FG484 A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip

A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip

A3P600-FG484 ✓ Activo

Comparación de especificaciones

Parámetro A3P600-FGG484I A3P600-FG484
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $55,30 $56,30
FPGA Family ProASIC3 —
System Gates 600000 —
Number of User I/O 235 —
Embedded SRAM 13.5 kB —
System Performance 231 MHz 231 MHz
Process Technology 130 nm 130 nm, 7-layer metal flash
Core Supply Voltage 1.5 V 1.425 V to 1.575 V
Package Type 484-FBGA —
Tipo de montaje Surface Mount Surface Mount
Operating Temperature Grade Industrial (I suffix) —
Lead-Free Finish Yes (LEAD FREE per Mouser listing) —
Configuration Flash-based, non-volatile, instant on —
Programming Interface JTAG —
Estado RoHS [DATA_NEEDED: RoHS compliance statement] RoHS3 Compliant (lead-free per FGG variant)
REACH Status [DATA_NEEDED: REACH compliance statement] —
AEC-Q100 Not applicable (FPGA) —
Tray Packaging Yes (per datasheets.com listing) —
Family — ProASIC3 (Flash FPGAs)
Total Gates — 600000 gates
Number of Registers — 13824
VersaTiles (Logic Elements) — 13824
Maximum User I/O — 235 I/O
Configuration Memory — On-chip flash (non-volatile, instant-on)
Embedded Memory — Embedded block SRAM (18 kbit blocks)
Soft Processor Support — ARM Cortex-M1 (optional soft core)
Encapsulado — 484-pin FBGA, 23x23 mm
Temperatura de funcionamiento — 0C to +85C (TJ)
Packaging — Tray
Programming — In-system programmable via JTAG, no external boot device

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