A3P600L-FGG484I vs A3P600-FGG484 Comparación

Comparación detallada lado a lado de A3P600L-FGG484I por Microchip Technology y A3P600-FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
A3P600L-FGG484I A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip

A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip

A3P600L-FGG484I ✓ Activo
Microchip Technology
A3P600-FGG484 A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 ✓ Activo

Comparación de especificaciones

Parámetro A3P600L-FGG484I A3P600-FGG484
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $41,35 $44,75
Product Series ProASIC3L —
FPGA Family Flash FPGA —
Total System Gates 600000 —
Logic Elements 13824 —
User I/Os 235 —
Maximum System Performance 350 MHz —
Core Supply Voltage 1.2 V to 1.5 V 1.5 V
Technology Node 130 nm CMOS —
Package Type 484-ball FBGA (PBGA484) —
Package Dimensions 23 mm x 23 mm —
Package Height 2.23 mm —
Ball Pitch 1 mm —
Tipo de montaje Surface Mount Surface Mount
Rango de temperatura de funcionamiento [DATA_NEEDED: industrial grade temperature range] —
Estado RoHS Compliant (Green) Lead Free
Configuration Non-volatile flash, instant-on —
Low Power Mode Flash*Freeze —
Family — ProASIC3
System Gates — 600K
Maximum System Frequency — 231 MHz
Process Technology — 130 nm CMOS
User I/O Count — 235
Encapsulado — 484-Pin FBGA (FGG484)
Configuration Memory — Flash-based (non-volatile, single chip)
Terminal Form — Ball
Package Shape — Square BGA
Temperature Grade — Commercial
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Operating Temperature Minimum — 0 C
Operating Temperature Maximum — [DATA_NEEDED: maximum operating temperature]
Number of Logic Elements (LEs) — [DATA_NEEDED: logic element count]
Embedded Memory — [DATA_NEEDED: embedded SRAM capacity]

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