A3PE1500-2FGG676 vs A3PE1500-1FG676I Comparación
Comparación detallada lado a lado de A3PE1500-2FGG676 por Microchip Technology y A3PE1500-1FG676I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip
A3PE1500-2FGG676 ✓ ActivoMicrochip Technology
A3PE1500-1FG676I - ProASIC3E FPGA 1.5M Gates | Microchip
A3PE1500-1FG676I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE1500-2FGG676 | A3PE1500-1FG676I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $33,50 | $65,89 |
| Product Family | ProASIC3E | — |
| System Gates | 1,500,000 | 1.5M |
| Logic Elements | 16KLEs | — |
| User I/O | 444 | — |
| Total RAM Bits | 276,480 | 276480 |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.5V |
| Temperatura de funcionamiento | 0°C to 85°C (TJ) | — |
| Speed Grade | -2 | — |
| System Performance | 310 MHz | — |
| Process Technology | 130 nm | 130nm, 7-layer metal (6 copper), Flash-based CMOS |
| Encapsulado | 676-BGA (FBGA) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Pitch | 1.000 mm | — |
| Configuration | Flash-based, reprogrammable | Non-volatile Flash (single-chip, live at power-up) |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| PLLs | [DATA_NEEDED: number of PLLs/CCs] | — |
| Security | AES-based design security | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Estado RoHS | RoHS Compliant | RoHS non-compliant (per DigChip listing) |
| Family | — | ProASIC3E |
| Logic Elements (CLBs) | — | 38400 |
| User I/Os | — | 444 |
| Max System Performance | — | 272MHz |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage range] |
| Package Type | — | FBGA-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) |
| Rango de temperatura de funcionamiento | — | 0°C to 70°C (per DigChip listing) |
| Programming | — | In-system programmable (ISP) via JTAG |
| Total Power Consumption | — | [DATA_NEEDED: total power consumption] |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Lead-Free Status | — | Contains lead (per DigChip listing) |