A3PE1500-1FG676I - ProASIC3E FPGA 1.5M Gates | Microchip
N.º de pieza: A3PE1500-1FG676I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $95.44 | $95,44 |
| 10 | $86.32 | $863,20 |
| 100 | $78.1 | $7.810,00 |
| 500 | $71.55 | $35.775,00 |
| 1.000 | $65.89 | $65.890,00 |
A3PE1500-1FG676I Descripción general
What is an FPGA? A Field Programmable Gate Array is an integrated circuit that can be configured by the designer after manufacturing to implement arbitrary digital logic. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks, configurable I/O, and routing resources; they are used for rapid prototyping, custom digital control, signal processing, and protocol bridging. The ProASIC3E family is built on a 130nm flash-based CMOS process, which means configuration is stored in non-volatile flash cells rather than external SRAM/EEPROM.
Key features include 1.5M system gates, 38,400 logic elements, 444 user I/Os, 276,480 bits of true dual-port SRAM, and up to 272MHz system performance. The flash fabric is live-at-power-up, eliminating the boot time and external configuration memory of SRAM FPGAs. In-system programming (ISP) is supported through JTAG, and the single-chip design reduces board area and bill-of-materials cost.
Technical depth: The device is manufactured in 130nm, seven-layer metal (six copper) flash-based CMOS. The non-volatile architecture provides instant-on operation and inherent design security because configuration bitstreams are not exposed on external memory buses. The FPGA supports a wide range of I/O standards through configurable I/O banks—though the exact I/O voltage list should be confirmed in the ProASIC3E datasheet—and includes dedicated clock conditioning circuitry.
Typical applications include communications infrastructure, industrial automation, medical electronics, aerospace and defense systems, automotive connectivity, and IoT edge processing. The 444 I/Os allow parallel bus interfaces, while the 1.5M gates are sufficient for soft-core processors, DSP datapaths, and protocol controllers.
Design consideration: The 1.5V core supply must be clean and adequately decoupled. Use a 0.1uF ceramic capacitor on each VCC/BGx pin and a 10uF bulk capacitor near the FPGA, with a solid ground plane; verify power sequencing if multiple I/O supplies are used. The FBGA-676 package has a 27 mm x 27 mm body with 1 mm ball pitch, requiring careful PCB fanout.
This page synthesizes distributor availability, pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a pre-engineering advantage for the A3PE1500-1FG676I.
Alternativas directas para A3PE1500-1FG676I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE1500-1FG676I (mismo factor de forma y huella) — difiere en Core Supply Voltage, System Gates, Configuration, Package, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE1500-1FGG676I
✅ Sustitución directa✓ En stock
$59.6 / unidad
Ver hoja de datos →A3PE1500-FG676I
✅ Sustitución directa✓ En stock
$60.2 / unidad
Ver hoja de datos →A3PE1500-1FG676
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
A3PE1500-2FGG676
✅ Sustitución directa✓ En stock
$33.5 / unidad
Ver hoja de datos →M1A3PE1500-1FG676I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
A3PE1500-1FG676I Valores máximos y características eléctricas
| Family | ProASIC3E |
| System Gates | 1.5M |
| Logic Elements (CLBs) | 38400 |
| User I/Os | 444 |
| Total RAM Bits | 276480 |
| Max System Performance | 272MHz |
| Core Supply Voltage | 1.5V |
| Process Technology | 130nm, 7-layer metal (6 copper), Flash-based CMOS |
| Package Type | FBGA-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | 0°C to 70°C (per DigChip listing) |
| Configuration | Non-volatile Flash (single-chip, live at power-up) |
| Programming | In-system programmable (ISP) via JTAG |
| Estado RoHS | RoHS non-compliant (per DigChip listing) |
| Lead-Free Status | Contains lead (per DigChip listing) |
Guía de configuración de pines de A3PE1500-1FG676I fbga-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height)
Configuración de pines para A3PE1500-1FG676I (encapsulado fbga-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE1500-1FG676I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE1500-1FG676I es adecuado para 6 aplicacións: Communications Infrastructure & Networking, Industrial Automation & Motor Control, Medical Electronics & Diagnostic Devices, Aerospace & Defense / Secure Systems, Automotive Connectivity & Infotainment, IoT & Edge Computing.
Communications Infrastructure & Networking
The A3PE1500-1FG676I suits communications line cards, Ethernet switches, and small-cell baseband processing. Its 444 user I/Os connect to parallel DDR SRAM, network processors, and PHY devices. The flash-based fabric provides instant-on configuration, reducing system startup time for carrier equipment; 1.5M gates are enough for packet parsing, queue management, and custom MAC logic. The 276,480 bits of true dual-port SRAM support FIFOs and header buffers without external memory. Its 272MHz system performance meets typical 100M/1G Ethernet control-plane tasks. In-system programming permits field updates via JTAG. Recommended companion ProASIC3E parts include lower-density A3P600-1FGG256 for I/O expansion and higher-density A3PE3000-2FG484 for aggregate switching logic.
Recomendado
Industrial Automation & Motor Control
In industrial PLCs, servo drives, and robot controllers, the A3PE1500-1FG676I implements high-speed encoder interfaces, PWM generation, and safety logic. The 1.5V core and 130nm flash process keep dynamic power moderate, while 444 I/Os allow parallel connection to ADCs, DACs, and fieldbus ASICs. The live-at-power-up feature is valuable on factory floors where a delayed boot from external configuration memory is unacceptable. The 1.5M-gate capacity can host a soft-core MCU and custom motion-control peripherals. Designers should confirm the temperature grade with the datasheet because the I-suffix is intended for industrial use. Recommended companion parts include A3P600-1FGG256 for slave I/O boards and M1AFS1500-1FG676 for systems needing an integrated analog front end.
Recomendado
Medical Electronics & Diagnostic Devices
For diagnostic imaging, patient monitors, and portable medical instruments, the A3PE1500-1FG676I offers determinism and security. Flash configuration prevents accidental bitstream exposure, aiding intellectual-property protection. The 444 I/Os interface with medical ADCs, displays, and communication bridges; the 1.5M gates handle imaging pipelines and control logic. Its instant-on behavior supports safety-critical power-up sequences. Although not AEC-Q100 (not applicable), the device can be qualified by the medical OEM. Use the industrial temperature grade option when needed. Recommended companion FPGAs include A3P250-1VQG100T for low-power sensor front ends and A3P400-1PQG208I for handheld control modules.
Recomendado
Aerospace & Defense / Secure Systems
In avionics, UAVs, and secure communication systems, the A3PE1500-1FG676I's non-volatile flash fabric supports secure boot and tamper-resistant designs. M1 variants provide enhanced screening for defense programs. 444 user I/Os connect to sensors, serializers, and encrypted data links; 1.5M gates are ample for crypto-cores, telemetry, and interface bridging. The 272MHz -1 speed grade balances performance and power. The 676-ball FBGA with 1mm pitch suits rugged boards with adequate thermal vias. Designers should evaluate the M1A3PE1500-1FG676I for military temperature ranges. Recommended companion devices include M1AFS1500-2FGG676 for mixed-signal SoC tasks and A3PE3000-1FGG484I for higher gate-count processing.
Recomendado
Automotive Connectivity & Infotainment
The A3PE1500-1FG676I can be used in automotive gateway, telematics, and infotainment systems that need fast logic and flexible I/O without ASIC NRE. The flash FPGA is live at power-up, helping cameras and displays initialize quickly. Its 444 I/Os support LVDS, MIPI (with external SerDes), and parallel RGB interfaces; 1.5M gates host video scaling, protocol conversion, and gateway routing logic. Although the base part is not AEC-Q100 qualified, for harsh environments designers should select qualified or screened variants based on the datasheet. The 1.5V core reduces switching noise in dense boards. Recommended companion FPGAs include A3P250-2FGG144I for sensor fusion and A3P400-2FGG144 for display bridging.
Recomendado
IoT & Edge Computing
For smart-home hubs, industrial IoT gateways, and edge AI pre-processing, the A3PE1500-1FG676I provides reconfigurable logic with minimal power overhead. The non-volatile flash configuration eliminates boot flash and reduces BOM. 1.5M gates can implement multiple protocol interfaces (Ethernet, CAN, UART, SPI), sensor aggregation, and lightweight machine-learning inference preprocessing. 276,480 bits of true dual-port SRAM buffer streaming data. Live-at-power-up enables sub-millisecond wakeup and deterministic I/O state. When power is critical, the 1.5V core and 130nm process help. Recommended companion parts include A3P060-1VQ100T for simple sensor nodes and A3P250-2VQG100 for edge gateway glue logic.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE1500-1FG676I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE1500-1FGG676I | A3PE1500-FG676I | A3PE1500-1FG676 | A3PE1500-2FGG676 | M1A3PE1500-1FG676I |
|---|---|---|---|---|---|---|
| Package | FBGA-676 | FBGA-676 (same) | FBGA-676 (same) | FBGA-676 (same) | FBGA-676 (same) | FBGA-676 (same) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5M | 1.5M | 1.5M | 1.5M | 1.5M | 1.5M |
| User I/O Count | 444 | 444 | 444 | 444 | 444 | 444 |
| Total RAM Bits | 276480 | 276480 | 276480 | 276480 | 276480 | 276480 |
| Max System Performance | 272MHz | 272MHz | 231MHz | 272MHz | 350MHz | 272MHz |
| Temperature Grade | Industrial (I-suffix; one listing 0-70C) | Industrial (I-suffix) | Industrial (I-suffix) | Commercial | Commercial | Military/Defense screening |
| RoHS Compliance | Non-compliant (contains lead) | Compliant (green package) | Non-compliant | Non-compliant | Compliant (green package) | Unknown |
Diferenciadores clave
- Higher -1 speed grade than base ProASIC3E parts (frente a A3PE1500-FG676I)
- Industrial I-suffix option not available on all variants (frente a A3PE1500-1FG676)
- Non-green FG package for cost-sensitive legacy designs (frente a A3PE1500-1FGG676I)
Notas de diseño
The A3PE1500-1FG676I operates from a 1.5V core supply with multiple VCC and ground balls. Decouple each VCC/BGx ball with a 0.1uF ceramic capacitor placed as close as possible to the ball, and add a 10uF bulk capacitor near one corner of the FPGA. If multiple I/O supply voltages are used, confirm sequencing requirements in the ProASIC3E datasheet to avoid latch-up or excessive current.
Estimated: for an FPGA dissipating 1.5W in the FBGA-676 package, the junction rise above ambient is theta_JA multiplied by power. Typical 27x27mm BGA theta_JA values range from 10-20C/W with airflow, so junction temperature could rise 15-30C. Add thermal vias under the exposed pad, use a solid ground plane, and provide airflow or a heatsink for high-utilization designs.
The 676-ball FBGA has 1mm ball pitch, requiring careful fanout. Use a 4-layer or 6-layer stackup with blind/buried vias if needed for dense routing. Keep high-speed I/O traces length-matched and impedance-controlled, and place decoupling capacitors on the bottom side directly opposite the FPGA's power balls when possible.
Because this is a flash-based FPGA, no external configuration memory is required. Do not leave the JTAG/ISP pins unconnected if field programming is expected; bring out TCK, TMS, TDI, TDO, and TRST to a header. Also, verify the temperature grade with the final Microchip datasheet—the I-suffix is normally industrial, but at least one distributor listing shows 0-70C for this part.
Información de cumplimiento
Per DigChip listing, A3PE1500-1FG676I contains lead and is RoHS non-compliant. The FGG676 variants are green/RoHS-compliant. AEC-Q100 not applicable for this FPGA family.
