A3PE3000-1FG324I vs A3PE3000L-FGG324I Comparación
Comparación detallada lado a lado de A3PE3000-1FG324I por Microchip Technology y A3PE3000L-FGG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
A3PE3000-1FG324I ✓ ActivoMicrochip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-1FG324I | A3PE3000L-FGG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $196,00 | $62,65 |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3,000,000 |
| Family | ProASIC3E | ProASIC3L (Flash FPGA) |
| Series | A3PE3000 | — |
| Number of I/Os | 221 | — |
| Maximum Operating Frequency | 272 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Encapsulado / Carcasa | 324-FBGA | — |
| Estilo de montaje | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Quiescent Supply Current | 25 mA | — |
| Configuration Memory | Flash (non-volatile, single-chip) | — |
| Programming Type | In-system reprogrammable | — |
| Packaging | Tray | Tray |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Bits | — | 516096 |
| User I/O | — | 221 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Encapsulado | — | 324-BGA FBGA (19x19 mm) |
| Tipo de montaje | — | Surface Mount (SMD) |
| Temperatura de funcionamiento | — | -40C to +100C (industrial) |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | — | Single-chip, no external boot PROM |
| Lead Free Status | — | Lead Free |
| Number of Package Balls | — | 324 |