A3PE3000-1FGG324I vs A3PE3000-FGG324I Comparación
Comparación detallada lado a lado de A3PE3000-1FGG324I por Microchip Technology y A3PE3000-FGG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG324I ✓ ActivoMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-1FGG324I | A3PE3000-FGG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $198,00 |
| Family | ProASIC3E (Flash-based FPGA) | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3,000,000 | 3000000 gates |
| User I/Os (this package) | 221 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Supply Voltage (core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Configuration | Flash-based, Live-at-Power-Up Level 0, single-chip | — |
| Soft CPU Support | Optional soft ARM support | — |
| Encapsulado | 324-BGA FBGA (19x19 mm, 1 mm pitch) | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (TJ) | -40 C to +125 C (Industrial, I grade) |
| Number of Gates | 3,000,000 | — |
| Speed Grade | -1 | — |
| Packaging | Tray | — |
| Estado RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Configuration Memory | — | Nonvolatile flash, reprogrammable, Instant-On |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |