A3PE3000-1FGG324I vs A3PE3000-FGG324I Comparaison
Comparaison détaillée côte à côte de A3PE3000-1FGG324I par Microchip Technology et A3PE3000-FGG324I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG324I ✓ ActifMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-1FGG324I | A3PE3000-FGG324I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $198,00 |
| Family | ProASIC3E (Flash-based FPGA) | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3,000,000 | 3000000 gates |
| User I/Os (this package) | 221 | — |
| Max User I/Os (family) | 616 | — |
| Embedded SRAM | 504 kbits true dual-port | — |
| Supply Voltage (core) | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Configuration | Flash-based, Live-at-Power-Up Level 0, single-chip | — |
| Soft CPU Support | Optional soft ARM support | — |
| Boîtier | 324-BGA FBGA (19x19 mm, 1 mm pitch) | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +100C (TJ) | -40 C to +125 C (Industrial, I grade) |
| Number of Gates | 3,000,000 | — |
| Speed Grade | -1 | — |
| Packaging | Tray | — |
| Statut RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS status] |
| Product Status | Active | — |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Configuration Memory | — | Nonvolatile flash, reprogrammable, Instant-On |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |