A3PE3000-2FG324I vs A3PE3000L-FGG324 Comparación
Comparación detallada lado a lado de A3PE3000-2FG324I por Microchip Technology y A3PE3000L-FGG324 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
A3PE3000-2FG324I ✓ ActivoMicrochip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-2FG324I | A3PE3000L-FGG324 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $86,15 |
| Manufacturer | Microchip Technology (Microsemi) | — |
| Family | ProASIC3E | ProASIC3L (Flash-based FPGA) |
| Logic Elements (LEs) | 35000 LEs | — |
| System Gates | 3M gates | 3,000,000 |
| Maximum System Performance | 310 MHz | — |
| Process Technology | 130 nm flash | — |
| Core Supply Voltage | 1.5 V | — |
| Number of I/Os | 221 I/O | — |
| Encapsulado / Carcasa | 324-Ball FBGA | — |
| Estilo de montaje | SMD/SMT | SMD/SMT |
| Operating Temperature (Min) | -40 C | — |
| Operating Temperature (Max) | +85 C | — |
| Speed Grade | -2 | — |
| Temperature Grade | Industrial (I) | — |
| Configuration Memory | Non-volatile Flash (single chip) | On-chip Flash (single-chip, nonvolatile) |
| Packaging | Tray | Tray |
| Product Series | A3PE3000 | — |
| Manufacturer Part Number | — | A3PE3000L-FGG324 |
| Logic Cells (CLBs) | — | 75264 |
| User I/O | — | 221 |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Tensión de alimentación de funcionamiento | — | 1.5 V |
| Maximum Operating Frequency | — | 250 MHz |
| Special Features | — | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down |
| Boundary Scan | — | IEEE 1149.1 (JTAG) |
| Encapsulado | — | 324-BGA / FBGA (FGG324) |
| Temperatura de funcionamiento | — | 0 C to +70 C (commercial) |
| Embedded RAM | — | [DATA_NEEDED: embedded RAM capacity] |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |