A3PE3000-2FGG324 vs A3PE3000-FGG324I Comparación
Comparación detallada lado a lado de A3PE3000-2FGG324 por Microchip Technology y A3PE3000-FGG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324 ✓ ActivoMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-2FGG324 | A3PE3000-FGG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $216,00 | $198,00 |
| Family | ProASIC3E | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3000000 | 3000000 gates |
| Logic Cells | 75264 | — |
| CLBs | 75264 | — |
| Maximum System Frequency | 310 MHz | — |
| Process Technology | 130 nm CMOS flash | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) | Nonvolatile flash, reprogrammable, Instant-On |
| User I/O | 221 | — |
| Total Memory Bits | [DATA_NEEDED: embedded SRAM capacity] | — |
| Encapsulado | 324-ball FBGA (FGG324) | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | 2 | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +125 C (Industrial, I grade) |
| Packaging Type | Tray | — |
| Estado RoHS | Green (RoHS compliant) | [DATA_NEEDED: RoHS status] |
| Automotive Qualification | Not qualified (standard grade) | — |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |