A3PE3000-2FGG324I vs A3PE3000-1FGG324I Comparación
Comparación detallada lado a lado de A3PE3000-2FGG324I por Microchip Technology y A3PE3000-1FGG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG324I ✓ ActivoMicrochip Technology
A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-1FGG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-2FGG324I | A3PE3000-1FGG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,00 | $0,00 |
| Family | ProASIC3E (Flash FPGA) | ProASIC3E (Flash-based FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Elements | [DATA_NEEDED: logic element count] | — |
| Number of I/Os | 221 | — |
| Embedded Memory | 516096 bit | — |
| Speed Grade | -2 | -1 |
| Tensión de alimentación | 1.425 V to 1.575 V | — |
| Temperatura de funcionamiento | -40C to +100C (TJ) | -40C to +100C (TJ) |
| Grade | Industrial | — |
| Encapsulado | 324-BGA (FBGA, 19x19 mm) | 324-BGA FBGA (19x19 mm, 1 mm pitch) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Technology | 130 nm Flash CMOS | — |
| Configuration | On-chip flash (nonvolatile, single chip) | Flash-based, Live-at-Power-Up Level 0, single-chip |
| Programmability | Reprogrammable (In-circuit) | — |
| Packaging | Tray | Tray |
| Estado RoHS | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Active | Active |
| Manufacturer Lead Time | 8 weeks | 8 weeks |
| User I/Os (this package) | — | 221 |
| Max User I/Os (family) | — | 616 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Supply Voltage (core) | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Soft CPU Support | — | Optional soft ARM support |
| Number of Gates | — | 3,000,000 |