A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
N.º de pieza: A3PE3000-2FGG324I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1 | $1,00 |
| 10 | $1 | $10,00 |
| 100 | $1 | $100,00 |
| 500 | $1 | $500,00 |
| 1.000 | $1 | $1.000,00 |
A3PE3000-2FGG324I Descripción general
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks and programmable interconnect. The ProASIC3E family belongs to the flash-based FPGA category, distinct from SRAM FPGAs because configuration is stored in on-chip nonvolatile flash cells, removing the need for an external boot flash and improving single-chip security and instant-on behavior.
Key features of the A3PE3000-2FGG324I include its flash-based single-chip architecture (low total cost of ownership, no configuration PROM), 221 user I/Os supporting single-ended and differential standards, embedded 516,096-bit flash memory, and reprogrammability with secure design storage. The -2 speed grade and industrial temperature range make it suitable for harsh-environment deployments.
Technically, the device is fabricated in 130nm flash CMOS process technology with a 1.5V core. The ProASIC3E fabric combines VersaTiles (logic modules), embedded RAM blocks, and flash configuration cells, supporting the Cortex-M1 soft processor and typical FPGA design flows in Libero SoC.
Typical applications include industrial automation and motor control, aerospace and defense subsystems, communications and networking line cards, and secure single-chip control logic where nonvolatile, tamper-resistant configuration is required.
A key design consideration is power: the 1.425V-1.575V core rail must be tightly regulated, and the 324-ball BGA requires careful PCB fanout and a dedicated power/ground ball pattern for signal integrity.
This page synthesizes verified distributor data, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para A3PE3000-2FGG324I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000-2FGG324I (mismo factor de forma y huella) — difiere en Package, Process Technology, Family, System Gates, Operating Temperature.
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A3PE3000-FGG324I
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →A3PE3000-2FGG324
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$216 / unidad
Ver hoja de datos →A3PE3000-2FG324I
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Consulte el precio
Ver hoja de datos →A3PE3000L-FGG324I
✅ Sustitución directa✓ En stock
$62.65 / unidad
Ver hoja de datos →A3PE3000-FG324I
✅ Sustitución directa✓ En stock
$1 / unidad
Ver hoja de datos →A3PE3000-2FGG324I Valores máximos y características eléctricas
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3000000 |
| Number of I/Os | 221 |
| Embedded Memory | 516096 bit |
| Speed Grade | -2 |
| Tensión de alimentación | 1.425 V to 1.575 V |
| Temperatura de funcionamiento | -40C to +100C (TJ) |
| Grade | Industrial |
| Encapsulado | 324-BGA (FBGA, 19x19 mm) |
| Tipo de montaje | Surface Mount |
| Technology | 130 nm Flash CMOS |
| Configuration | On-chip flash (nonvolatile, single chip) |
| Programmability | Reprogrammable (In-circuit) |
| Packaging | Tray |
| Estado RoHS | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
Guía de configuración de pines de A3PE3000-2FGG324I 324-bga (fbga, 19x19 mm)
Configuración de pines para A3PE3000-2FGG324I (encapsulado 324-bga (fbga, 19x19 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000-2FGG324I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000-2FGG324I es adecuado para 6 aplicacións: Industrial Automation and Motor Control, Aerospace and Defense Subsystems, Communications and Networking Line Cards, Secure Embedded Control, Test and Measurement Instrumentation, Battery-Powered and Low-Power Portable Systems.
Industrial Automation and Motor Control
The A3PE3000-2FGG324I fits industrial automation because its 3M-gate fabric integrates state machines, PWM generators, and encoder interfaces in one chip, while its -40C to +100C industrial rating survives factory-floor thermal extremes. Its 221 user I/Os drive multiple motor-drive axes, and instant-on flash configuration means drives and PLC I/O modules are ready at power-up with no configuration controller. Used as the glue-logic and sequencing hub between an MCU or the Cortex-M1 soft core and IGBT gate drivers, it processes encoder feedback and generates gate-timing signals with deterministic latency. The trade-off versus an MCU is higher power at the 1.5V core rail, so budget switching activity in Libero SoC power analysis.
Recomendado
Aerospace and Defense Subsystems
Aerospace and defense designs choose the A3PE3000-2FGG324I because flash-based configuration resists readback and bit-flip-induced reconfiguration of the kind that affects SRAM FPGAs, and the single-chip nonvolatile architecture eliminates a boot PROM that would add failure modes. The -40C to +100C industrial junction range covers most avionics bay environments, and the 19x19 mm FGG324 BGA supports vibration-tolerant, high-usage solder attachment. Typical roles include sensor-interface formatting, bus bridging, and payload sequencing with the 516 kbit embedded flash storing calibration or mission data. Verify program-level qualification and radiation requirements directly with Microchip, as standard industrial grading does not by itself imply TID or SEE character.
Recomendado
Communications and Networking Line Cards
In networking line cards, the A3PE3000-2FGG324I bridges backplane buses, implements framing and statistics logic, and sequences PHYs, leveraging the -2 speed grade's roughly 310 MHz system performance for high-throughput paths. Its 221 I/Os support LVDS and other differential standards for high-speed interconnect, and nonvolatile startup means a line card initializes immediately when hot-plugged without waiting for a configuration download. The 516 kbit flash stores board serials and microcode. Design consideration: the FGG324's 221 I/O must be budgeted across banks to match VCCI rails of attached PHYs, and signal-integrity simulation is recommended for edges faster than 500 MHz.
Recomendado
Secure Embedded Control
Secure control applications - encryption key storage lifecycles, authentication nodes, anti-tamper logic - benefit from the A3PE3000-2FGG324I's on-chip flash configuration: the bitstream is not externally readable at power-up the way SRAM FPGA bitstreams are, and no external flash device exposes the design on a readable bus. The 516,096-bit embedded flash provides on-chip nonvolatile storage for keys or IDs, and the 3M-gate fabric implements cryptographic cores such as AES or SHA engines with margin. The industrial temperature range suits unattended field equipment. Trade-off: flash FPGAs offer fewer hard security primitives than newer families, so layer board-level tamper detection alongside the FPGA logic.
Recomendado
Test and Measurement Instrumentation
Bench and automated test equipment uses the A3PE3000-2FGG324I as timing-controller and pattern-generator logic: the -2 speed grade and 130nm fabric deliver precise, deterministic trigger and sampling strobes, while 221 I/Os interface with relays, ADC front-ends, and host backplanes. Instant-on flash configuration lets an instrument be ready within milliseconds of power-up - a measurable advantage in rack systems that power-cycle channels frequently. The embedded flash stores calibration constants per unit. Design note: use Libero SoC timing constraints to keep trigger-path skew under 1 ns and route trigger I/O on matched-length traces from the FGG324 balls.
Recomendado
Battery-Powered and Low-Power Portable Systems
For portable and battery-backed systems needing programmable logic, the A3PE3000-2FGG324I offers flash FPGAs' hallmark advantage over SRAM parts: zero configuration current at power-up and no boot device. The 1.5V core with 1.425V-1.575V tolerance suits efficient point-of-load regulation from a single-cell Li-ion via a buck converter. Where battery budget is dominant, the pin-compatible low-power variant A3PE3000L-FGG324I runs at reduced core voltage for further savings. Use the 516 kbit flash for event logs and the fabric for sensor-fusion preprocessing. Estimated: at 100 MHz with moderate utilization, core dynamic power is typically in the hundreds of milliwatts - run Libero power analysis with your actual toggle rates.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000-2FGG324I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000-FGG324I | A3PE3000-2FGG324 | A3PE3000-2FG324I | A3PE3000L-FGG324I | A3PE3000-FG324I |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (FGG324, 19x19 mm) | 324-FBGA (FGG324) - same footprint | 324-FBGA (FGG324) - same footprint | 324-BGA (FG324, standard pitch) | 324-FBGA (FGG324) - same footprint | 324-BGA (FG324, standard pitch) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 221 | 221 | 221 | 221 | 221 | 221 |
| Embedded Flash | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit |
| Operating Temperature | -40C to +100C (TJ, industrial) | Industrial (-40C to +100C) | Commercial | Industrial (-40C to +100C) | Industrial | Industrial (-40C to +100C) |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Diferenciadores clave
- Fastest -2 speed grade in the FGG324 industrial family (frente a A3PE3000-FGG324I)
- Industrial temperature rating on the fine-pitch FGG324 footprint (frente a A3PE3000-2FGG324)
- Single-chip flash configuration (frente a SRAM-based competitor FPGAs)
- Trade-off: higher power than the L low-power variant (frente a A3PE3000L-FGG324I)
Notas de diseño
The 1.5V core rail must stay within 1.425V-1.575V under all load transients. Use a point-of-load buck converter with at least 3 A headroom and bulk capacitance local to the FGG324 power balls; I/O bank VCCI rails must be sequenced with or before the core per the ProASIC3E datasheet (DS0098) power-up specification. Verify per-bank I/O standards early in Libero SoC because bank VCCI choices (2.5V/3.3V) constrain which standards can be placed in each bank.
The 324-ball 19x19 mm FGG324 uses fine-pitch balls: design your land pattern strictly per the DS0098 mechanical drawing and confirm whether your footprint is FGG (fine pitch) or FG (standard pitch) - the A3PE3000-2FGG324I will NOT fit an FG324 pattern. Plan fanout with via-in-pad or dog-bone escapes, and reserve solid power/ground ball grids for low-inductance return paths. Do not route high-speed signals under the package without a reference plane.
For differential I/O pairs (LVDS and similar standards), maintain matched intra-pair lengths within a few millimeters and observe the datasheet note that each used differential I/O pair reduces available single-ended I/Os by two - budget your 221 I/Os accordingly. Note the DS0098 limitation that on A3PE1500/A3PE3000 devices usage of certain I/O standards is restricted; check the standards table before committing your pin assignment.
Lead time is 8 weeks from the manufacturer, so qualify a drop-in alternative (e.g., A3PE3000-FGG324I at standard speed grade) as a supply-risk hedge and verify timing closure at the slower grade in Libero SoC before approving the swap. Also confirm temperature grade codes: the non-'I' suffix part (A3PE3000-2FGG324) is commercial grade and must not be used in -40C industrial systems despite identical footprint.
Información de cumplimiento
ROHS3 Compliant per Microchip USA product data. Lead-free consistent with ROHS3. REACH, halogen-free, and conflict-minerals status not stated in provided data.
