A3PE3000-FG896I vs A3PE3000L-1FGG896I Comparación
Comparación detallada lado a lado de A3PE3000-FG896I por Microchip Technology y A3PE3000L-1FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip
A3PE3000-FG896I ✓ ActivoMicrochip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FG896I | A3PE3000L-1FGG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $195,00 | $0,00 |
| Family | ProASIC3E Flash Family FPGAs | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3M gates | 3000000 |
| Logic Elements | 35KLEs | — |
| User I/Os | 620 | — |
| Maximum System Frequency | 231 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | Nonvolatile Flash (single-chip, Instant On) | — |
| Encapsulado | 896-Pin FBGA (896-BGA) | 896-ball FBGA, 1 mm pitch |
| Package Dimensions | 31 x 31 x 2.44 mm | — |
| Terminal Form | Ball | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Rango de temperatura de funcionamiento | Industrial (-40C to +85C) | — |
| Temperature Grade | I (Industrial) | — |
| Packaging | Tray | — |
| Estado RoHS | RoHS Compliant: Yes | [DATA_NEEDED: RoHS status] |
| Programming Support | Reprogrammable, Cortex-M1 soft processor support | — |
| User I/O | — | 620 |
| Embedded SRAM | — | 504 kbits true dual-port |
| Speed Grade | — | -1 |
| Core Voltage | — | 1.2 V to 1.5 V |
| PLLs | — | 6 |
| Maximum System Performance | — | Approx. 272 MHz |
| Configuration Technology | — | Nonvolatile flash, single-chip, Instant On |
| Low Power Feature | — | Flash*Freeze Technology |
| Temperatura de funcionamiento | — | -40C to +85C (industrial, I suffix) |
| Logic Family | — | CMOS |
| Power-Up Support | — | Live at Power-Up Level 0 |