A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
N.º de pieza: A3PE3000L-1FGG896I ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3PE3000L-1FGG896I Descripción general
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. This places the ProASIC3L family in the power management-oriented branch of the FPGA taxonomy: unlike SRAM FPGAs, it is single-chip, Instant On at power-up, and inherently secure because the bitstream never leaves the device. Its hierarchy runs: A3PE3000L -> ProASIC3L family -> flash FPGA -> field-programmable gate array -> programmable logic device.
Key features include 1.2 V to 1.5 V core voltage operation, Flash*Freeze technology that dramatically cuts dynamic and static power without losing register or SRAM state, six PLLs for clock management, and speed grade -1 performance up to approximately 272 MHz. The 130-nm, 7-layer metal (6 copper layers) flash-based CMOS process combines high logic density with live-at-power-up Level 0 support, eliminating the boot delay and configuration controller required by SRAM FPGAs.
The low-power architecture makes this device well suited to battery-powered and thermally constrained systems. Flash*Freeze mode allows the fabric to be frozen in microseconds while I/O states are held, resuming full-speed operation just as quickly, which is valuable in duty-cycled instruments and portable data acquisition units.
Typical applications include industrial automation controllers, portable medical and test instrumentation, aerospace and defense subsystems requiring secure single-chip configuration, and communication line-card glue logic.
Designers should budget board space and stack-up for the 1 mm pitch 896-ball FBGA and verify power sequencing across the core and I/O banks; the industrial -40C to +85C rating of the I-suffix part must be observed in thermal analysis.
This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para A3PE3000L-1FGG896I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000L-1FGG896I (mismo factor de forma y huella) — difiere en Package, Family, Configuration Memory, Process Technology, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE3000L-1FGG896
✅ Sustitución directa✓ En stock
$255 / unidad
Ver hoja de datos →A3PE3000L-FGG896I
✅ Sustitución directa✓ En stock
$139.9 / unidad
Ver hoja de datos →A3PE3000L-FG896
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000-1FGG896I
✅ Sustitución directa✓ En stock
$219 / unidad
Ver hoja de datos →M1A3PE3000L-1FGG896I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
A3PE3000L-1FGG896I Valores máximos y características eléctricas
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) |
| System Gates | 3000000 |
| User I/O | 620 |
| Embedded SRAM | 504 kbits true dual-port |
| Encapsulado | 896-ball FBGA, 1 mm pitch |
| Speed Grade | -1 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| PLLs | 6 |
| Maximum System Performance | Approx. 272 MHz |
| Configuration Technology | Nonvolatile flash, single-chip, Instant On |
| Low Power Feature | Flash*Freeze Technology |
| Temperatura de funcionamiento | -40C to +85C (industrial, I suffix) |
| Logic Family | CMOS |
| Tipo de montaje | Surface Mount |
| Power-Up Support | Live at Power-Up Level 0 |
Guía de configuración de pines de A3PE3000L-1FGG896I 896-ball fbga, 1 mm pitch
Configuración de pines para A3PE3000L-1FGG896I (encapsulado 896-ball fbga, 1 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000L-1FGG896I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000L-1FGG896I es adecuado para 6 aplicacións: Industrial Automation and Control, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Communications Line Cards and Network Gear, Medical and Diagnostic Equipment, Secure Single-Chip Embedded Systems.
Industrial Automation and Control
The A3PE3000L-1FGG896I fits industrial controllers because its 3M system gates absorb motor sequencing, interlock logic, and multi-protocol interfaces in one chip, while the industrial -40C to +85C rating matches factory-floor environments. Six PLLs generate the multiple clock domains typical of fieldbus, encoder, and HMI subsystems without external clock tree devices. Flash*Freeze technology lets the controller drop into a microwatt-class standby between production cycles while holding all state, and the nonvolatile flash configuration survives power interruptions that would blank an SRAM FPGA, cutting reboot time to zero after a brown-out on the 24 V industrial rail.
Recomendado
Portable and Battery-Powered Instrumentation
Battery-operated test and data-acquisition instruments benefit directly from the L-suffix power optimizations. With 1.2 V to 1.5 V core operation and Flash*Freeze mode, dynamic power drops by orders of magnitude during idle periods while 504 kbits of SRAM preserve captured waveforms. The single-chip, Instant On flash configuration eliminates the external boot device and its standby current, an advantage over SRAM FPGAs in portable designs. With 620 user I/O available on the FGG896 package, one device can interface high-channel-count sensor arrays, display drivers, and USB or Ethernet bridges simultaneously, reducing board area and quiescent budget compared with multi-chip solutions.
Recomendado
Aerospace and Defense Subsystems
The ProASIC3L flash architecture is attractive in defense electronics because the configuration bitstream never leaves the chip, providing inherent protection against bitstream interception on untrusted interfaces, and the fabric is live at power-up Level 0, meeting strict time-to-first-data requirements in radar and avionics front ends. The 130-nm, 7-layer metal (6 copper) process supports approx. 272 MHz system performance for the -1 speed grade, enough for preprocessing pipelines, while six PLLs condition multiple mission clocks. Designers in this domain should pair the FPGA with Microchip radiation-tolerant power and support devices and confirm the specific program-level screening requirements beyond the standard industrial rating.
Recomendado
Communications Line Cards and Network Gear
In networking equipment the A3PE3000L-1FGG896I serves as glue logic and preprocessing fabric between MACs, PHYs, and backplane interfaces. The 620 user I/O on a 1 mm pitch 896-ball FBGA supports wide parallel buses and multiple gigabit interfaces on one die, and six PLLs generate the line-card clock architecture from a single reference. Flash*Freeze allows unused line cards to enter a low-power standby that resumes in microseconds when traffic arrives, cutting rack-level power draw. True dual-port SRAM of 504 kbits implements deep FIFOs and statistics buffers, while single-chip Instant On configuration means a line card is fully operational as soon as shelf power is applied.
Recomendado
Medical and Diagnostic Equipment
Medical imaging front ends and patient-monitoring systems use the A3PE3000L-1FGG896I to sequence sensor arrays, filter streaming data, and drive display and communication interfaces. The 3M-gate fabric and 504 kbits dual-port SRAM handle multi-channel acquisition pipelines, while single-chip nonvolatile configuration supports the deterministic power-up behavior expected in certified medical devices - there is no configuration download window during which the system is in an undefined state. Flash*Freeze reduces heat and battery drain in portable ultrasound and handheld diagnostic units, and the industrial -40C to +85C rating covers sterilization-adjacent and cold-chain storage environments that exceed commercial temperature limits.
Recomendado
Secure Single-Chip Embedded Systems
For embedded systems where firmware security matters, the flash-based ProASIC3L stores its configuration entirely on-chip and supports design locking against readback, eliminating the external configuration flash that is a common attack surface on SRAM FPGAs. The 3M-gate capacity implements encryption wrappers, secure boot state machines, and tamper-response logic alongside user logic, with six PLLs and approx. 272 MHz -1 speed grade performance for symmetric cipher pipelines. Instant On, live-at-power-up Level 0 operation ensures security functions are active from the first clock edge. This makes the device a fit for secure industrial gateways, payment terminals, and government communications equipment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000L-1FGG896I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000L-1FGG896 | A3PE3000L-FGG896I | A3PE3000-1FGG896I | M1A3PE3000L-1FGG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896), 1 mm pitch | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 | 3000000 |
| Embedded SRAM | 504 kbits dual-port | 504 kbits dual-port | 504 kbits dual-port | 504 kbits dual-port | 504 kbits dual-port |
| User I/O | 620 | 620 | 620 | 616 | 620 |
| Temperature Range | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | No (standard ProASIC3E) | Yes |
| Embedded ARM Cortex-M1 | No | No | No | No | Yes |
| PLLs | 6 | 6 | 6 | 6 | 6 |
Diferenciadores clave
- Flash*Freeze low-power mode with state retention (frente a A3PE3000-1FGG896I)
- Industrial temperature rating (frente a A3PE3000L-1FGG896)
- Pure fabric design at lower cost than Cortex-M1 version (frente a M1A3PE3000L-1FGG896I)
Notas de diseño
The A3PE3000L operates from a 1.2 V to 1.5 V core supply with separate I/O bank supplies. Power each I/O bank according to the standards it must interface (2.5 V, 3.3 V, etc.) and verify per-bank current limits against your I/O utilization - with up to 620 user I/O simultaneously switching, ground bounce and di/dt on the core rail become the dominant supply concerns. Use wide planes and bulk capacitance at each supply, and consult Microchip power estimation tools in Libero for fabric current before fixing the regulator sizing.
The 896-ball FBGA with 1 mm pitch requires a minimum of via-in-pad or dogbone fanout on at least the outer two ball rows; plan layer count early - typically 8 or more layers are needed to escape 620 I/O while preserving power planes. Follow the ballout in the ProASIC3L datasheet (DS50003268) during pin planning in Libero so that power/ground ball assignments match the board split. Do not swap supply balls; the flash-based die has fixed power ball positions.
Estimated: with a 3M-gate fabric running at moderate utilization, dynamic power can reach several hundred milliwatts to over a watt depending on clock rates; combine this with your actual Libero power report. The FGG896 package dissipates largely through the ball array into the PCB, so solid ground planes and adequate airflow matter for the -40C to +85C industrial rating. Verify junction temperature stays within the datasheet maximum at your worst-case ambient, especially in sealed enclosures.
Do not substitute a commercial-grade A3PE3000L-1FGG896 for the industrial -40C to +85C I-suffix part in extended-temperature designs. Also remember that flash FPGAs are live at power-up: input logic levels during board bring-up are applied to a running device, so add pull resistors on critical control inputs to define safe states before firmware control is established. Finally, re-run timing closure in Libero when changing speed grades - the -1 grade limits maximum system frequency.
Información de cumplimiento
Compliance status was not stated in the retrieved web data; consult the Microchip product page or environmental datasheet for RoHS/REACH status. The FGG suffix conventionally denotes lead-free balls, but this must be confirmed against official Microchip documentation.
