A3PE3000-FG896I vs A3PE3000L-FGG896I Comparación
Comparación detallada lado a lado de A3PE3000-FG896I por Microchip Technology y A3PE3000L-FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip
A3PE3000-FG896I ✓ ActivoMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FG896I | A3PE3000L-FGG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $195,00 | $139,90 |
| Family | ProASIC3E Flash Family FPGAs | ProASIC3L |
| System Gates | 3M gates | 3000000 |
| Logic Elements | 35KLEs | — |
| User I/Os | 620 | — |
| Maximum System Frequency | 231 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash | — |
| Configuration Memory | Nonvolatile Flash (single-chip, Instant On) | — |
| Encapsulado | 896-Pin FBGA (896-BGA) | — |
| Package Dimensions | 31 x 31 x 2.44 mm | — |
| Terminal Form | Ball | — |
| Tipo de montaje | Surface Mount | Surface Mount (SMD/SMT) |
| Rango de temperatura de funcionamiento | Industrial (-40C to +85C) | — |
| Temperature Grade | I (Industrial) | — |
| Packaging | Tray | Tray, standard quantity 27 |
| Estado RoHS | RoHS Compliant: Yes | [DATA_NEEDED: RoHS status] |
| Programming Support | Reprogrammable, Cortex-M1 soft processor support | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Tensión de alimentación | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| Encapsulado / Carcasa | — | 896-BGA (FBGA, 1 mm pitch) |
| Temperatura de funcionamiento | — | Industrial grade (I suffix) |
| Speed Grade | — | Standard (no speed suffix) |