A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
N.º de pieza: A3PE3000L-FGG896I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $189.5 | $189,50 |
| 10 | $175.2 | $1.752,00 |
| 100 | $162.8 | $16.280,00 |
| 500 | $151.4 | $75.700,00 |
| 1.000 | $139.9 | $139.900,00 |
A3PE3000L-FGG896I Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and embedded memory that designers program to implement custom digital circuits. Within the programmable logic hierarchy, the A3PE3000L sits at the top of the ProASIC3L low-power family, positioned below the Fusion and Igloo families in the broader power management and embedded processing ecosystem. Unlike SRAM-based FPGAs, it uses nonvolatile flash cells for configuration.
Key features include flash-based nonvolatile configuration enabling single-chip, Live-at-Power-Up (Level 0) operation with no external boot PROM, the Flash*Freeze technology unique to the ProASIC3L family that dramatically cuts static and dynamic power while retaining SRAM state, and 130-nm 7-layer-metal (6 copper) flash-based CMOS process technology. The device supports 1.2V to 1.5V core voltage operation for low total cost of ownership.
Technically, the ProASIC3L fabric combines versatile logic elements with embedded block SRAM organized as true dual-port memories, supporting high-bandwidth pipelined designs. The flash switch architecture is inherently secure and immune to configuration readback, and the single-chip solution reduces board cost, boot time, and reliability risks compared with SRAM FPGA boot architectures.
Typical applications include industrial automation controllers, portable and battery-powered instrumentation, secure communications equipment, and aerospace/defense systems where instant-on operation, low static power, and configuration security are mandatory.
When designing with this device, budget core voltage within the 1.14V to 1.575V window and exploit Flash*Freeze mode to extend battery life; the 896-FBGA footprint requires careful ball-mapping to escape all 620 I/Os.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para A3PE3000L-FGG896I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000L-FGG896I (mismo factor de forma y huella) — difiere en Package, Family, Configuration Memory, RoHS Status, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE3000L-FGG896
✅ Sustitución directa✓ En stock
$55 / unidad
Ver hoja de datos →A3PE3000L-1FGG896I
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000L-1FGG896
✅ Sustitución directa✓ En stock
$255 / unidad
Ver hoja de datos →A3PE3000L-FG896I
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000L-FG896
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000-FGG896I
✅ Sustitución directa✓ En stock
$135.2 / unidad
Ver hoja de datos →A3PE3000L-FGG896I Valores máximos y características eléctricas
| Family | ProASIC3L |
| System Gates | 3000000 |
| Total RAM Bits | 516096 bits |
| Embedded Memory Type | True Dual-Port SRAM (504 kbits) |
| Number of I/O | 620 |
| Tensión de alimentación | 1.14 V to 1.575 V |
| Core Voltage Support | 1.2 V to 1.5 V |
| Logic Family / Process | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | Flash*Freeze technology, single-chip solution |
| Encapsulado / Carcasa | 896-BGA (FBGA, 1 mm pitch) |
| Tipo de montaje | Surface Mount (SMD/SMT) |
| Temperatura de funcionamiento | Industrial grade (I suffix) |
| Packaging | Tray, standard quantity 27 |
| Speed Grade | Standard (no speed suffix) |
Guía de configuración de pines de A3PE3000L-FGG896I 896-bga (fbga, 1 mm pitch)
Configuración de pines para A3PE3000L-FGG896I (encapsulado 896-bga (fbga, 1 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000L-FGG896I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000L-FGG896I es adecuado para 6 aplicacións: Industrial Automation and Control, Battery-Powered Portable Instrumentation, Secure Communications Equipment, Aerospace and Defense Systems, Medical Diagnostic Equipment, Test and Measurement Systems.
Industrial Automation and Control
The A3PE3000L-FGG896I fits industrial automation controllers that need deterministic glue logic, motor-interface bridging, and protocol conversion with instant-on behavior. Its 3M system gates and 620 user I/Os absorb multiple ASIC/CPLD functions, while 516096 bits of true dual-port SRAM buffer sensor and fieldbus data. Flash-based Live-at-Power-Up Level 0 configuration means the FPGA is functional the moment plant power is applied - no boot delay that could trip watchdogs on moving machinery. Industrial-temperature rating covers harsh cabinet environments, and Flash*Freeze allows idle stations to drop static power between production cycles, reducing cabinet heat and energy cost.
Recomendado
Battery-Powered Portable Instrumentation
Portable test and measurement instruments benefit directly from ProASIC3L low-power features. The A3PE3000L-FGG896I runs its core from 1.14V to 1.575V, minimizing dynamic power, and Flash*Freeze mode retains SRAM state while dramatically cutting static and dynamic current during standby - ideal between measurements. Because configuration is stored in nonvolatile flash on-chip, no boot current is spent loading a bitstream from external memory, unlike SRAM FPGAs. With 620 I/Os, the device can drive displays, acquisition front-ends, and communication interfaces from a single chip, cutting board area in handheld enclosures where every millimeter and milliwatt counts.
Recomendado
Secure Communications Equipment
The A3PE3000L-FGG896I suits secure radios, encryption bridges, and network appliances where configuration security is mandatory. The flash-based fabric stores the bitstream in nonvolatile cells with no configuration readback path, mitigating bitstream-extraction attacks common to SRAM FPGAs. Live-at-Power-Up Level 0 operation enables secure, single-chip designs with no external configuration device to probe. The 3M-gate fabric implements AES/SHA accelerators and packet engines, while 620 I/Os support multiple redundant communication interfaces. For defense programs, Microsemi/Microchip lineage provides a recognized high-reliability supply chain.
Recomendado
Aerospace and Defense Systems
Avionics and defense payloads value the A3PE3000L-FGG896I for its radiation-tolerant heritage family, instant-on operation, and configuration immunity. Flash cells are inherently more resistant to configuration upsets than SRAM configuration latches, reducing need for external scrubbing circuitry. The 896-FBGA industrial package supports conformally coated flight boards, and Flash*Freeze supports duty-cycled satellite subsystems that must conserve orbit-average power. The 3M-gate capacity implements sensor preprocessing, Telemetry encoders, and bus interfaces (MIL-STD-1553 bridges, SpaceWire glue logic) in a single chip, simplifying redundancy design.
Recomendado
Medical Diagnostic Equipment
Medical imaging front-ends and patient-monitoring platforms use the A3PE3000L-FGG896I to aggregate ADC data, drive control sequencing, and manage display interfaces. The 516096-bit true dual-port SRAM enables ping-pong buffering of sample streams with deterministic latency. Because the FPGA is Live-at-Power-Up Level 0, acquisition hardware is ready immediately when the device powers on - important for emergency-room equipment with strict boot-time requirements. Low static power via Flash*Freeze suits battery-backed portable monitors, while the single-chip flash architecture reduces BOM count, supporting the reliability documentation medical device manufacturers must supply.
Recomendado
Test and Measurement Systems
Bench instruments, logic analyzers, and automated test equipment leverage the A3PE3000L-FGG896I as a reprogrammable timing, triggering, and protocol engine. The 3M-gate fabric reconfigures between test profiles at the bench, while 620 I/Os probe multiple channels simultaneously and the true dual-port SRAM captures event traces. Instant-on flash configuration shortens instrument power-up sequence, and configuration security protects proprietary test IP from cloning. Industrial temperature rating supports rack-mounted systems with elevated internal ambient temperatures, and the low 1.14V to 1.575V core reduces supply design complexity in dense racks.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000L-FGG896I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000L-FGG896 | A3PE3000L-1FGG896I | A3PE3000L-FG896I | A3PE3000-FGG896I |
|---|---|---|---|---|---|
| Package | 896-FBGA (1 mm pitch) | 896-FBGA - same | 896-FBGA - same | 896-FBGA - same | 896-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Total RAM Bits | 516096 | 516096 | 516096 | 516096 | 516096 |
| Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.5 V (standard ProASIC3 core) |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | No (ProASIC3, non-L) |
| Temperature Grade | Industrial (I) | Commercial | Industrial (I) | Industrial (I) | Industrial (I) |
Diferenciadores clave
- Flash*Freeze technology with SRAM state retention (frente a A3PE3000-FGG896I)
- Faster timing option on identical footprint (frente a A3PE3000L-1FGG896I)
- Industrial temperature qualification (frente a A3PE3000L-FGG896)
Notas de diseño
Budget the core rail at 1.2V nominal with tolerance inside the 1.14V to 1.575V window specified in the ProASIC3L datasheet. Estimated: at 3M gates with moderate utilization, dynamic current can reach the ampere range - size the core regulator and decoupling network (multiple 100uF bulk plus 0.1uF and 0.01uF ceramics per bank) accordingly. Exploit Flash*Freeze for duty-cycled systems: route the FFE pin to a controllable GPIO of your supervisor so firmware can enter/exit the low-power state cleanly while retaining SRAM.
The 896-ball FBGA at 1 mm pitch requires a fine-line PCB (5/5 mil trace/space minimum) with via-in-pad or dogbone fanout. Escape all 620 used I/Os across at least 6-8 signal layers; plan power/ground planes early. Follow the Microchip package mechanical drawing for exact ball A1 marker orientation and land-pattern dimensions, and follow Microchip high-speed board design application notes for length-matched groups on DDR or source-synchronous interfaces.
Do not confuse family variants when generating programming files: A3PE3000L (ProASIC3L, with Flash*Freeze) and A3PE3000 (ProASIC3, without Flash*Freeze) are pin-compatible but require different device selection in Libero SoC; a bitstream generated for the wrong family will not program. Also verify I/O bank VCCI assignments per bank before wiring to 3.3V or 2.5V logic, and check the industrial 'I' suffix temperature limits against your worst-case enclosure ambient.
Información de cumplimiento
Related 896-FBGA variant A3PE3000L-FGG896 is listed as LEAD FREE on Mouser; formal RoHS/REACH declarations should be obtained from the Microchip product page for the exact order code.
