A3PE3000-FGG324 vs A3PE3000-FG324 Comparación
Comparación detallada lado a lado de A3PE3000-FGG324 por Microchip Technology y A3PE3000-FG324 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip
A3PE3000-FGG324 ✓ ActivoMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FGG324 | A3PE3000-FG324 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $335,22 | $112,30 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Cells | 75264 cells | — |
| Number of I/O | 221 | — |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.5 V |
| Process Technology | 130 nm flash | 130 nm CMOS |
| Maximum System Frequency | 231 MHz | 231 MHz |
| Embedded Flash Bits | 516096 bits | — |
| Configuration Type | Flash (nonvolatile, single-chip) | — |
| Encapsulado | 324-Ball FBGA (FGG324) | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Package Dimensions | 19 x 19 mm, 1.63 mm height, 1 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Soft ARM Support | Yes (optional soft ARM core support) | — |
| Estado RoHS | Green (compliant) | RoHS Non-Compliant (contains lead, per digichip listing) |
| Temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Technology Node Family | CMOS flash FPGA | — |
| Logic Elements / CLBs | — | 75,264 |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Packaging | — | Tray |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |