A3PE3000-FGG324 vs A3PE3000-FG324 Comparação

Comparação detalhada lado a lado de A3PE3000-FGG324 por Microchip Technology e A3PE3000-FG324 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
A3PE3000-FGG324 A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip

A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip

A3PE3000-FGG324 ✓ Ativo
Microchip Technology
A3PE3000-FG324 A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

A3PE3000-FG324 ✓ Ativo

Comparação de especificações

Parâmetro A3PE3000-FGG324 A3PE3000-FG324
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $335,22 $112,30
Family ProASIC3E ProASIC3E Flash Family
System Gates 3000000 gates 3,000,000
Logic Cells 75264 cells —
Number of I/O 221 —
Core Supply Voltage 1.425 V to 1.575 V 1.5 V
Process Technology 130 nm flash 130 nm CMOS
Maximum System Frequency 231 MHz 231 MHz
Embedded Flash Bits 516096 bits —
Configuration Type Flash (nonvolatile, single-chip) —
Encapsulamento 324-Ball FBGA (FGG324) 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch
Package Dimensions 19 x 19 mm, 1.63 mm height, 1 mm pitch —
Tipo de montagem Surface Mount Surface Mount
Soft ARM Support Yes (optional soft ARM core support) —
Status RoHS Green (compliant) RoHS Non-Compliant (contains lead, per digichip listing)
Temperatura de operação [DATA_NEEDED: Operating Temperature] [DATA_NEEDED: operating temperature range]
Technology Node Family CMOS flash FPGA —
Logic Elements / CLBs — 75,264
User I/Os — 221
Configuration Technology — Flash (non-volatile, single-chip)
In-System Programming — Yes (JTAG, IEEE 1532-compliant)
Security — 128-bit AES decryption via JTAG; FlashLock
Packaging — Tray
Embedded Memory — [DATA_NEEDED: embedded SRAM bits]
PLLs — [DATA_NEEDED: number of PLLs]
I/O Standards Supported — [DATA_NEEDED: supported I/O standards]
Lead Free Status — Contains Lead (per digichip listing)
Device ESD/HBM Rating — [DATA_NEEDED: ESD rating]

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