A3PE3000-FGG324I vs A3PE3000L-FG324I Comparación
Comparación detallada lado a lado de A3PE3000-FGG324I por Microchip Technology y A3PE3000L-FG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActivoMicrochip Technology
A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
A3PE3000L-FG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FGG324I | A3PE3000L-FG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $0,00 |
| Family | ProASIC3E (ProASIC3E Flash Family) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Elements (CLBs) | 75264 | — |
| Total User I/O | 221 | — |
| Embedded Memory | 516096 bits | — |
| Maximum Frequency | 350 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm CMOS, nonvolatile flash | — |
| Encapsulado | 324-BGA (FBGA/PBGA324), 19 x 19 mm | 324-ball FBGA (FG324), 19x19 mm |
| Ball Pitch | 1 mm | — |
| Package Height | 1.63 mm | — |
| Temperatura de funcionamiento | -40 C to +125 C (Industrial, I grade) | -40C to +100C (Industrial, I suffix) |
| Configuration Memory | Nonvolatile flash, reprogrammable, Instant-On | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (FG package contains lead) |
| Logic Cells (CLBs) | — | 75264 |
| User I/O | — | 221 |
| Embedded SRAM | — | 516096 bits (up to 144 kbits true dual-port blocks per family) |
| Core Voltage | — | 1.2 V (1.2 V to 1.5 V supported) |
| Process Technology | — | 130 nm CMOS, 7-layer metal (6 copper), flash-based |
| Configuration | — | Nonvolatile flash, Instant On (Level 0 support) |
| Low Power Feature | — | Flash*Freeze technology |
| Max Frequency | — | [DATA_NEEDED: maximum system frequency] |
| JTAG Boundary Scan | — | IEEE 1149.1 |
| Input Option | — | Schmitt Trigger on single-ended inputs |
| Lead Free Status | — | Contains Lead |