A3PE3000-FGG324I vs A3PE3000L-FG324I Comparaison
Comparaison détaillée côte à côte de A3PE3000-FGG324I par Microchip Technology et A3PE3000L-FG324I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActifMicrochip Technology
A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
A3PE3000L-FG324I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-FGG324I | A3PE3000L-FG324I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $0,00 |
| Family | ProASIC3E (ProASIC3E Flash Family) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Elements (CLBs) | 75264 | — |
| Total User I/O | 221 | — |
| Embedded Memory | 516096 bits | — |
| Maximum Frequency | 350 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm CMOS, nonvolatile flash | — |
| Boîtier | 324-BGA (FBGA/PBGA324), 19 x 19 mm | 324-ball FBGA (FG324), 19x19 mm |
| Ball Pitch | 1 mm | — |
| Package Height | 1.63 mm | — |
| Température de fonctionnement | -40 C to +125 C (Industrial, I grade) | -40C to +100C (Industrial, I suffix) |
| Configuration Memory | Nonvolatile flash, reprogrammable, Instant-On | — |
| Type de montage | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (FG package contains lead) |
| Logic Cells (CLBs) | — | 75264 |
| User I/O | — | 221 |
| Embedded SRAM | — | 516096 bits (up to 144 kbits true dual-port blocks per family) |
| Core Voltage | — | 1.2 V (1.2 V to 1.5 V supported) |
| Process Technology | — | 130 nm CMOS, 7-layer metal (6 copper), flash-based |
| Configuration | — | Nonvolatile flash, Instant On (Level 0 support) |
| Low Power Feature | — | Flash*Freeze technology |
| Max Frequency | — | [DATA_NEEDED: maximum system frequency] |
| JTAG Boundary Scan | — | IEEE 1149.1 |
| Input Option | — | Schmitt Trigger on single-ended inputs |
| Lead Free Status | — | Contains Lead |