A3PE3000-FGG484 vs A3PE3000L-1FGG484 Comparación
Comparación detallada lado a lado de A3PE3000-FGG484 por Microchip Technology y A3PE3000L-1FGG484 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip
A3PE3000-FGG484 ✓ ActivoMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000-FGG484 | A3PE3000L-1FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $152,60 | $134,00 |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Cells | 75264 | 75,264 |
| User I/O | 341 | — |
| Total RAM Bits | 516096 | — |
| Maximum Operating Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Program Memory Type | Flash (non-volatile) | — |
| Tipo de montaje | Surface Mount | — |
| Encapsulado | 484-BGA (FBGA-484), 23 x 23 mm, 1 mm pitch, 2.23 mm height | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | 0C to +70C |
| Speed Grade | [DATA_NEEDED: speed grade code] | -1 |
| Estado RoHS | RoHS Compliant (FGG lead-free variant) | [DATA_NEEDED: RoHS status] |
| Supplier Device Package | 484-FBGA | — |
| Programming Support | Microchip Libero SoC design suite | — |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Estilo de montaje | — | SMD/SMT |
| Packaging | — | Tray |
| Power-Up Mode | — | Live at power-up (Level 0 support) |