A3PE3000-FGG484 vs A3PE3000L-1FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000-FGG484 par Microchip Technology et A3PE3000L-1FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip
A3PE3000-FGG484 ✓ ActifMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-FGG484 | A3PE3000L-1FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $152,60 | $134,00 |
| Family | ProASIC3E | ProASIC3L |
| System Gates | 3000000 gates | 3,000,000 |
| Logic Cells | 75264 | 75,264 |
| User I/O | 341 | — |
| Total RAM Bits | 516096 | — |
| Maximum Operating Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.5 V | — |
| Program Memory Type | Flash (non-volatile) | — |
| Type de montage | Surface Mount | — |
| Boîtier | 484-BGA (FBGA-484), 23 x 23 mm, 1 mm pitch, 2.23 mm height | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | 0C to +70C |
| Speed Grade | [DATA_NEEDED: speed grade code] | -1 |
| Statut RoHS | RoHS Compliant (FGG lead-free variant) | [DATA_NEEDED: RoHS status] |
| Supplier Device Package | 484-FBGA | — |
| Programming Support | Microchip Libero SoC design suite | — |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Embedded SRAM | — | Up to 504 kbits true dual-port |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Style de montage | — | SMD/SMT |
| Packaging | — | Tray |
| Power-Up Mode | — | Live at power-up (Level 0 support) |