A3PE3000L-1FG484M vs A3PE3000L-FG484M Comparación
Comparación detallada lado a lado de A3PE3000L-1FG484M por Microchip Technology y A3PE3000L-FG484M por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M ✓ ActivoMicrochip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-1FG484M | A3PE3000L-FG484M |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $129,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 | 3000000 (3.00E6) |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Number of I/O | 341 | — |
| Maximum Frequency | 250 MHz | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Technology | 130 nm flash process | — |
| Configuration Memory | On-chip Flash (instant-on, reprogrammable) | Nonvolatile on-chip flash, live at power-up (Level 0) |
| Low Power Feature | Flash*Freeze technology | — |
| Encapsulado | 484-ball FBGA (FG484) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | -1 (standard) | — |
| Temperature Grade / Operating Temp | M (per ordering code); [DATA_NEEDED: exact operating temperature range] | — |
| JTAG Boundary Scan | IEEE 1149.1 supported | — |
| Input Options | Schmitt trigger option on single-ended inputs (A3PE3000L) | — |
| Pull Options | Weak pull-up / pull-down | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements (VersaTiles) | — | 75264 |
| True Dual-Port SRAM | — | 504 kbits |
| User I/O | — | 341 (up to 616 in larger packages) |
| Process Technology | — | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Logic Family | — | CMOS |
| Low-Power Feature | — | Flash*Freeze technology |
| Temperatura de funcionamiento | — | 0 to 70 C |
| Tensión de alimentación | — | 1.5 V |
| Package Type | — | FBGA-484, 1 mm pitch, 23 x 23 mm |
| Pins / Balls | — | 484 |
| Single-Chip Solution | — | Yes (no external configuration device required) |